Semiconductor device and method for manufacturing semiconductor device

ABSTRACT

Provided is a highly reliable semiconductor device which includes a transistor including an oxide semiconductor. The semiconductor device includes an oxide semiconductor layer; a gate insulating layer provided over the oxide semiconductor layer; a gate electrode layer overlapping with the oxide semiconductor layer with the gate insulating layer provided therebetween; an insulating layer being in contact with part of an upper surface of the oxide semiconductor layer, covering a side surface of the gate insulating layer and a side surface and an upper surface of the gate electrode layer, and having a lower oxygen-transmitting property than the gate insulating layer; a sidewall insulating layer provided on the side surface of the gate electrode layer with the insulating layer provided therebetween; a source electrode layer and a drain electrode layer which are electrically connected to the oxide semiconductor layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.13/755,004, filed Jan. 31, 2013, now allowed, which claims the benefitof a foreign priority application filed in Japan as Serial No.2012-025469 on Feb. 8, 2012, both of which are incorporated byreference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The disclosed invention relates to a semiconductor device and a methodfor manufacturing the semiconductor device.

In this specification and the like, a semiconductor device refers to alltypes of devices which can function by utilizing semiconductorcharacteristics; an electro-optical device, a light-emitting displaydevice, a semiconductor circuit, and an electronic device are allsemiconductor devices.

2. Description of the Related Art

A technique by which transistors are formed using semiconductor thinfilms formed over a substrate having an insulating surface has beenattracting attention. The transistor is applied to a wide range ofsemiconductor devices such as an integrated circuit (IC) and an imagedisplay device (also simply referred to as display device). Asilicon-based semiconductor material is widely known as a material for asemiconductor thin film applicable to a transistor. As another material,an oxide semiconductor has been attracting attention.

For example, a technique is disclosed by which a transistor ismanufactured using zinc oxide or an In—Ga—Zn-based oxide as an oxidesemiconductor (see Patent Documents 1 and 2).

Meanwhile, it has been pointed out that hydrogen behaves as a source ofcarriers in an oxide semiconductor. Therefore, some measures need to betaken to prevent hydrogen from entering the oxide semiconductor at thetime of depositing the oxide semiconductor. Further, a technique isdisclosed by which variation of a threshold voltage is suppressed byreducing the hydrogen content of not only the oxide semiconductor butalso a gate insulating film in contact with the oxide semiconductor (seePatent Document 3).

REFERENCE

-   [Patent Document 1] Japanese Published Patent Application No.    2007-123861-   [Patent Document 2] Japanese Published Patent Application No.    2007-096055-   [Patent Document 3] Japanese Published Patent Application No.    2009-224479

SUMMARY OF THE INVENTION

Moreover, as well as hydrogen, an oxygen vacancy contained in an oxidesemiconductor behaves as a carrier supply source. The oxygen vacancy inthe oxide semiconductor serves as a donor to generate an electron thatis a carrier in the oxide semiconductor. When many oxygen vacanciesexist in an oxide semiconductor including a channel formation region ofa transistor, electrons are generated in the channel formation region,which is a cause of shift of the threshold voltage of the transistor inthe negative direction.

In view of the above problem, an object of one embodiment of the presentinvention is to provide a method for manufacturing a semiconductordevice including an oxide semiconductor, which is capable of havingstable electric characteristics and achieving high reliability.

In one embodiment of the invention disclosed in this specification andthe like, a transistor including an oxide semiconductor layer, a gateelectrode layer overlapping with the oxide semiconductor layer, and agate insulating layer provided between the oxide semiconductor layer andthe gate electrode layer has a structure in which a side surface of thegate insulating layer is covered with an insulating film having a loweroxygen-transmitting property (having a barrier property against oxygen)than the gate insulating layer.

The side surface of the gate insulating layer is covered with aninsulating film having a lower oxygen-transmitting property than thegate insulating layer, whereby oxygen can be prevented from beingeliminated from end portions of the gate insulating layer. Since thegate insulating layer is an insulating layer which is in contact with achannel formation region of the oxide semiconductor layer, prevention ofelimination of oxygen from the gate insulating layer can preventextraction of oxygen from the oxide semiconductor layer (in particular,from the channel formation region of the oxide semiconductor layer) dueto oxygen vacancies in the gate insulating layer. That is, occurrence ofoxygen vacancies in the oxide semiconductor layer can be prevented.

Further, the gate insulating layer preferably includes a regioncontaining a large amount of oxygen which exceeds the amount of oxygenin the stoichiometric ratio (hereinafter also referred to as anoxygen-excess region). When the gate insulating layer in contact withthe oxide semiconductor layer includes an oxygen-excess region, oxygencan be supplied to the oxide semiconductor layer, so that oxygen can beprevented from being eliminated from the oxide semiconductor layer, andaccordingly oxygen vacancies in the layer can be filled.

As the insulating layer covering the side surface of the gate insulatinglayer, a film which transmits less impurities such as hydrogen andmoisture and less oxygen (a film having a high shielding effect(blocking effect) of preventing penetration of both impurities such ashydrogen and moisture and oxygen) is preferably used. With such a film,during and after the manufacturing process, an impurity such as hydrogenor moisture can be prevented from entering the oxide semiconductorlayer, and oxygen which is a main component of the oxide semiconductorcan be prevented from being released from the oxide semiconductor layer.As the film having a high shielding effect of preventing penetration ofboth impurities such as hydrogen and moisture and oxygen, for example,an aluminum oxide film can be used.

One embodiment of the present invention is a semiconductor deviceincluding an oxide semiconductor layer; a gate insulating layer providedover the oxide semiconductor layer; a gate electrode layer overlappingwith the oxide semiconductor layer with the gate insulating layerprovided therebetween; an insulating layer being in contact with part ofan upper surface of the oxide semiconductor layer, covering a sidesurface of the gate insulating layer and a side surface and an uppersurface of the gate electrode layer, and having a loweroxygen-transmitting property than the gate insulating layer; a sidewallinsulating layer provided on the side surface of the gate electrodelayer with the insulating layer provided therebetween; and a sourceelectrode layer and a drain electrode layer which are electricallyconnected to the oxide semiconductor layer.

Further, one embodiment of the present invention is a semiconductordevice including an oxide semiconductor layer which isnon-single-crystal and includes a crystalline component and an amorphouscomponent; a gate insulating layer provided over the oxide semiconductorlayer; a gate electrode layer overlapping with the oxide semiconductorlayer with the gate insulating layer provided therebetween; aninsulating layer being in contact with part of an upper surface of theoxide semiconductor layer, covering a side surface of the gateinsulating layer and a side surface and an upper surface of the gateelectrode layer, and having a lower oxygen-transmitting property thanthe gate insulating layer; a sidewall insulating layer provided on theside surface of the gate electrode layer with the insulating layerprovided therebetween; and a source electrode layer and a drainelectrode layer which are in contact with the oxide semiconductor layer.In the oxide semiconductor layer, in regions of the oxide semiconductorlayer which are contact with the source electrode layer and the drainelectrode layer, a ratio of the crystalline component content to theamorphous component content is lower than that in a region overlappingwith the gate electrode layer. Furthermore, in the crystallinecomponent, a c-axis is preferably aligned in a direction parallel to anormal vector of a surface where the oxide semiconductor layer is formedor a normal vector of a surface of the oxide semiconductor layer.

In the above oxide semiconductor device, a metal oxide film having a lowpermeability to oxygen and hydrogen is preferably included as theinsulating layer.

Further, one embodiment of the present invention is a method formanufacturing a semiconductor device including the steps of forming anoxide semiconductor layer on an insulating surface, forming a gateinsulating film over the oxide semiconductor layer, forming a gateelectrode layer over the oxide semiconductor layer with the gateinsulating film provided therebetween, forming a gate insulating layerbetween the oxide semiconductor layer and the gate electrode layer byetching the gate insulating film using the gate electrode layer as amask, forming a first insulating film having a lower oxygen-transmittingproperty than the gate insulating layer over the oxide semiconductorlayer and the gate electrode layer, forming a second insulating filmover the first insulating film, forming a sidewall insulating layercovering a side surface of the gate electrode layer with the firstinsulating film provided therebetween by etching the second insulatingfilm, forming an insulating layer which is in contact with part of anupper surface of the oxide semiconductor layer and which covers a sidesurface of the gate insulating layer and a side surface and an uppersurface of the gate electrode layer by etching the first insulatingfilm, and forming a source electrode layer and a drain electrode layerwhich are electrically connected to the oxide semiconductor layer.

In the above method for manufacturing a semiconductor device, a metaloxide film is preferably formed as the first insulating film. Further,the metal oxide film is preferably formed in such a manner that a metalfilm is formed over the oxide semiconductor layer and the gate electrodelayer and then the metal film is subjected to oxygen doping treatment.

According to one embodiment of the present invention, a semiconductordevice which uses an oxide semiconductor and can have stable electriccharacteristics and high reliability can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1C are a plan view and cross-sectional views illustratingone embodiment of a semiconductor device.

FIGS. 2A to 2C are cross-sectional views showing one example of a methodfor manufacturing a semiconductor device.

FIGS. 3A to 3D are cross-sectional views showing one example of a methodfor manufacturing a semiconductor device.

FIGS. 4A to 4C are cross-sectional views showing one example of a methodfor manufacturing a semiconductor device.

FIGS. 5A and 5B are cross-sectional views each illustrating oneembodiment of a semiconductor device.

FIGS. 6A to 6D are cross-sectional views showing one example of a methodfor manufacturing a semiconductor device.

FIGS. 7A to 7D are cross-sectional views each illustrating oneembodiment of a semiconductor device.

FIGS. 8A to 8C are a plane view, a cross-sectional view, and a circuitdiagram illustrating one embodiment of a semiconductor device.

FIG. 9 is a perspective view illustrating one embodiment of asemiconductor device.

FIG. 10 is a cross-sectional view illustrating one embodiment of asemiconductor device.

FIGS. 11A to 11C are a block diagram illustrating one embodiment of asemiconductor device and partial diagrams of the block diagram.

FIGS. 12A to 12C each illustrate an electronic device.

FIGS. 13A to 13C illustrate an electronic device.

FIGS. 14A to 14C illustrate electronic devices.

FIGS. 15A and 15B are a plan view and a cross-sectional viewillustrating one embodiment of a semiconductor device.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, embodiments of the invention disclosed in thisspecification will be described with reference to the accompanyingdrawings. However, the invention disclosed in this specification is notlimited to the following description, and it will be easily understoodby those skilled in the art that modes and details thereof can bevariously changed. Therefore, the invention disclosed in thisspecification is not construed as being limited to the description ofthe following embodiments. Note that in structures of the presentinvention described below, the same portions or portions having similarfunctions are denoted by the same reference numerals in differentdrawings, and description thereof is not repeated. Further, the samehatching pattern is applied to portions having similar functions, andthe portions are not especially denoted by reference numerals in somecases.

Note that in this specification and the like, ordinal numbers such as“first” and “second” are used in order to avoid confusion amongcomponents and do not limit the number.

Embodiment 1

In this embodiment, one embodiment of a semiconductor device and amethod for manufacturing the semiconductor device will be described withreference to FIGS. 1A to 1C, FIGS. 2A to 2C, FIGS. 3A to 3D, and FIGS.4A to 4C. In this embodiment, a transistor including an oxidesemiconductor layer is shown as an example of the semiconductor device.

FIGS. 1A to 1C illustrate a structural example of a transistor 420. FIG.1A is a plan view of the transistor 420, FIG. 1B is a cross-sectionalview taken along line X1-Y1 in FIG. 1A, and FIG. 1C is a cross-sectionalview taken along line V1-W1 in FIG. 1A. Note that in FIG. 1A, somecomponents of the transistor 420 (e.g., an insulating layer 407) are notillustrated for clarity.

The transistor 420 illustrated in FIGS. 1A to 1C includes an oxidesemiconductor layer 403 provided over a substrate 400, a gate insulatinglayer 402 provided over the oxide semiconductor layer 403, a gateelectrode layer 401 overlapping with the oxide semiconductor layer 403with the gate insulating layer 402 provided therebetween, an insulatinglayer 411 which is in contact with part of an upper surface of the oxidesemiconductor layer 403 and which covers a side surface of the gateinsulating layer 402 and a side surface and an upper surface of the gateelectrode layer 401, a sidewall insulating layer 412 provided on theside surface of the gate electrode layer 401 with the insulating layer411 provided therebetween, and a source electrode layer 405 a and adrain electrode layer 405 b which are electrically connected to theoxide semiconductor layer 403.

In the transistor 420, as the insulating layer 411 provided to be incontact with part of the upper surface of the oxide semiconductor layer403, the side surface of the gate insulating layer 402, and the sidesurface and the upper surface of the gate electrode layer 401, aninsulating layer having a barrier property against oxygen is used.Specifically, as the insulating layer 411, an insulating layer having alower oxygen-transmitting property than the gate insulating layer isused. The insulating layer having a barrier property against oxygenprovided as the insulating layer 411 can prevent oxygen from beingeliminated from the side surface of the gate insulating layer 402. Sincethe gate insulating layer 402 is an insulating layer which is in contactwith a channel formation region of the oxide semiconductor layer 403,prevention of elimination of oxygen from the insulating layer canprevent extraction of oxygen from the oxide semiconductor layer 403 dueto oxygen vacancies in the gate insulating layer 402. That is,occurrence of oxygen vacancies in the oxide semiconductor layer 403 canbe prevented.

The insulating layer 411 can have a single-layer structure or astacked-layer structure of an oxide film or a nitride film containing,for example, aluminum, aluminum to which magnesium is added, aluminum towhich titanium is added, magnesium, or titanium.

It is preferable that the gate insulating layer 402 also include anoxygen-excess region for the following reason. When the gate insulatinglayer 402 includes an oxygen-excess region, oxygen can be supplied tothe oxide semiconductor layer 403. Accordingly, elimination of oxygenfrom the oxide semiconductor layer 403 can be prevented, and oxygenvacancies in the layer can be filled.

Note that a base insulating layer 436 and/or an insulating layer 407provided over the substrate 400 may be components of the transistor 420.Since the base insulating layer 436 and the insulating layer 407 areinsulating layers which are in contact with the oxide semiconductorlayer 403, in a manner similar to that of the gate insulating layer 402,the base insulating layer 436 and the insulating layer 407 preferablyeach include an oxygen-excess region.

As the insulating layer 411, in addition to having a barrier propertyagainst oxygen, a film which transmits less impurities such as hydrogenand moisture is preferably used. As such a film, an aluminum oxide filmcan preferably be used. With the use of an aluminum oxide film as theinsulating layer 411, not only elimination of oxygen from the oxidesemiconductor layer is prevented, but also entry of impurities such ashydrogen and moisture into the oxide semiconductor layer 403, whichmight cause variation in electric characteristics of the transistor, canbe suppressed.

Note that the aluminum oxide film preferably has a high density (filmdensity higher than or equal to 3.2 g/cm³, preferably higher than orequal to 3.6 g/cm³), because a property of transmitting oxygen and/orhydrogen can be further reduced and the transistor 420 can have stableelectric characteristics. The film density can be measured by Rutherfordbackscattering spectrometry (RBS) or X-ray reflection (XRR).

The oxide semiconductor layer 403 included in the transistor 420 may bein a non-single-crystal state, for example. The non-single-crystal stateis, for example, structured by at least one of c-axis aligned crystal(CAAC), polycrystal, microcrystal, and an amorphous part. The density ofdefect states of an amorphous part is higher than those of microcrystaland CAAC. The density of defect states of microcrystal is higher thanthat of CAAC. Note that an oxide semiconductor including CAAC isreferred to as a CAAC-OS (c-axis aligned crystalline oxidesemiconductor).

For example, an oxide semiconductor layer may include a CAAC-OS. In theCAAC-OS, for example, c-axes are aligned, and a-axes and/or b-axes arenot macroscopically aligned.

For example, an oxide semiconductor layer may include microcrystal. Notethat an oxide semiconductor including microcrystal is referred to as amicrocrystalline oxide semiconductor. A microcrystalline oxidesemiconductor layer includes microcrystal (also referred to asnanocrystal) with a size greater than or equal to 1 nm and less than 10nm, for example. Alternatively, a microcrystalline oxide semiconductorlayer, for example, includes a crystal-amorphous mixed phase structurewhere crystal parts (each of which is greater than or equal to 1 nm andless than 10 nm) are distributed.

For example, an oxide semiconductor layer may include an amorphous part.Note that an oxide semiconductor including an amorphous part is referredto as an amorphous oxide semiconductor. An amorphous oxide semiconductorfilm, for example, has disordered atomic arrangement and no crystallinecomponent. Alternatively, an amorphous oxide semiconductor film is, forexample, absolutely amorphous and has no crystal part.

Note that the oxide semiconductor layer 403 may be a mixed filmincluding any of a CAAC-OS, a microcrystalline oxide semiconductor, andan amorphous oxide semiconductor. The mixed film, for example, includesa region of an amorphous oxide semiconductor, a region of amicrocrystalline oxide semiconductor, and a region of a CAAC-OS.Further, the mixed film may have a stacked structure including a regionof an amorphous oxide semiconductor, a region of a microcrystallineoxide semiconductor, and a region of a CAAC-OS, for example.

Note that the oxide semiconductor layer 403 may be in a single-crystalstate, for example.

In this embodiment, the oxide semiconductor layer 403 isnon-single-crystal and preferably includes crystalline components andamorphous components. Further, the oxide semiconductor layer 403preferably includes a first region 403 a overlapping with the gateinsulating layer 402 and second regions 403 b in which the ratio ofcrystalline components to amorphous components is lower than that in thefirst region 403 a. It is preferable that the second regions 403 b be incontact with the source electrode layer 405 a and the drain electrodelayer 405 b and that the first region 403 a serve as a channel formationregion.

The first region 403 a serving as the channel formation region of theoxide semiconductor layer 403 preferably includes a plurality of crystalparts. In each of the crystal parts, a c-axis is preferably aligned in adirection parallel to a normal vector of a surface where the oxidesemiconductor film is formed or a normal vector of a surface of theoxide semiconductor film. Note that, among crystal parts, the directionsof the a-axis and the b-axis of one crystal part may be different fromthose of another crystal part. An example of such an oxide semiconductorlayer is a CAAC-OS film. That is, the first region 403 a is preferablythe CAAC-OS film.

The CAAC-OS film is not absolutely amorphous. The CAAC-OS film, forexample, is an oxide semiconductor film with a crystal-amorphous mixedphase structure where crystal components and amorphous components areintermingled. Note that in most cases, the crystal component fits insidea cube whose one side is less than 100 nm. In an image obtained with atransmission electron microscope (TEM), a boundary between an amorphouscomponent and a crystal component and a boundary between crystalcomponents in the CAAC-OS film are not clearly detected. Further, withthe TEM, a grain boundary in the CAAC-OS film is not clearly found.Thus, in the CAAC-OS film, a reduction in electron mobility due to thegrain boundary is suppressed.

In each of the crystal components included in the CAAC-OS film, a c-axisis aligned in a direction parallel to a normal vector of a surface wherethe CAAC-OS film is formed or a normal vector of a surface of theCAAC-OS film, triangular or hexagonal atomic arrangement which is seenfrom the direction perpendicular to the a-b plane is formed, and metalatoms are arranged in a layered manner or metal atoms and oxygen atomsare arranged in a layered manner when seen from the directionperpendicular to the c-axis. Note that, among crystal components, thedirections of the a-axis and the b-axis of one crystal component may bedifferent from those of another crystal component. In thisspecification, a simple term “perpendicular” includes a range from 85°to 95°. In addition, a simple term “parallel” includes a range from −5°to 5°.

In the CAAC-OS film, distribution of crystal components is notnecessarily uniform. For example, in the formation process of theCAAC-OS film, in the case where crystal growth occurs from a surfaceside of the oxide semiconductor layer, the proportion of crystalcomponents in the vicinity of the surface of the oxide semiconductorlayer is higher than that in the vicinity of the surface on which theoxide semiconductor layer is formed in some cases. Further, when animpurity is added to the CAAC-OS film, the crystal component in a regionto which the impurity is added becomes amorphous in some cases.

Since the c-axes of the crystal components included in the CAAC-OS filmare aligned in the direction parallel to a normal vector of a surfacewhere the CAAC-OS film is formed or a normal vector of a surface of theCAAC-OS film, the directions of the c-axes may be different from eachother depending on the shape of the CAAC-OS film (the cross-sectionalshape of the surface where the CAAC-OS film is formed or thecross-sectional shape of the surface of the CAAC-OS film). Note that thefilm deposition is accompanied with the formation of the crystalcomponents or followed by the formation of the crystal componentsthrough crystallization treatment such as heat treatment. Hence, thec-axes of the crystal components are aligned in the direction parallelto a normal vector of the surface where the CAAC-OS film is formed or anormal vector of the surface of the CAAC-OS film.

With the use of the CAAC-OS film in a transistor, variation in electriccharacteristics of the transistor due to irradiation with visible lightor ultraviolet light is small. Thus, the transistor has highreliability.

Description of this embodiment will be given on the assumption that thefirst region 403 a of the oxide semiconductor layer 403 is the CAAC-OSfilm; however, the oxide semiconductor layer 403 may be single crystalor polycrystalline (also referred to as polycrystal).

When the first region 403 a is the CAAC-OS film, the ratio of thecrystalline components to the amorphous components is high in the firstregion 403 a and the ratio of the crystalline components to theamorphous components is low in the second regions 403 b. Note that thesecond regions 403 b may be amorphous.

In a transistor including an oxide semiconductor, oxygen is eliminatedfrom a side surface of the oxide semiconductor layer in some cases dueto etching treatment for etching the oxide semiconductor layer into adesired shape, exposure of the side surface of the oxide semiconductorlayer to a reduced-pressure atmosphere, or the like. Oxygen vacanciesdue to elimination of oxygen serve as a source of carriers and influenceelectric characteristics of the transistor. In particular, when a regionwhere oxygen vacancies are formed is provided between a source and adrain, the region serves as an unintentional path of carriers, that is,a parasitic channel. Especially, when the oxide semiconductor layer isthe CAAC-OS film, in the vicinity of the side surface of the oxidesemiconductor layer, oxygen is more easily eliminated and carriers aremore easily generated than in the vicinity of the upper surface.Therefore, prevention of elimination of oxygen from the oxidesemiconductor layer is important to obtain a transistor having stableelectrical characteristics.

In the transistor 420 described in this embodiment, the side surfaces inthe channel width direction of the oxide semiconductor layer 403 arecovered with the gate insulating layer 402 and the insulating layer 411having a high barrier property against oxygen, whereby elimination ofoxygen from the region between the source and the drain can beprevented. Further, in the case where the gate insulating layer 402includes an oxygen-excess region, by provision of the insulating layer411, oxygen can be effectively supplied to the oxide semiconductor layer403; therefore, oxygen vacancies in the oxide semiconductor layer 403can be filled. Accordingly, the influence of a parasitic channel can besuppressed in the transistor 420 and a highly reliable semiconductordevice can be provided with the use of the transistor 420.

An example of a method for manufacturing the transistor 420 will bedescribed below with reference to FIGS. 2A to 2C, FIGS. 3A to 3D, andFIGS. 4A to 4C.

The base insulating layer 436 is formed over the substrate 400 having aninsulating surface.

There is no particular limitation on a substrate that can be used as thesubstrate 400 having an insulating surface as long as it has at leastheat resistance to withstand heat treatment performed later. Forexample, a glass substrate of barium borosilicate glass,aluminoborosilicate glass, or the like, a ceramic substrate, a quartzsubstrate, or a sapphire substrate can be used. A single crystalsemiconductor substrate or a polycrystalline semiconductor substrate ofsilicon, silicon carbide, or the like; a compound semiconductorsubstrate of silicon germanium or the like; an SOI substrate; or thelike can be used as the substrate 400, or the substrate provided with asemiconductor element can be used as the substrate 400.

The semiconductor device may be manufactured using a flexible substrateas the substrate 400. To manufacture a flexible semiconductor device,the transistor 420 including the oxide semiconductor layer 403 may bedirectly formed over a flexible substrate; or alternatively, thetransistor 420 including the oxide semiconductor layer 403 may be formedover a manufacturing substrate and then separated and transferred to aflexible substrate. Note that in order to separate the transistor 420from the manufacturing substrate and transfer it to the flexiblesubstrate, a separation layer may be provided between the manufacturingsubstrate and the transistor 420 including the oxide semiconductorlayer.

The base insulating layer 436 can have a single-layer structure or astacked-layer structure of one or more films containing silicon oxide,silicon nitride, silicon oxynitride, silicon nitride oxide, aluminumoxide, aluminum nitride, aluminum oxynitride, aluminum nitride oxide,hafnium oxide, gallium oxide, or a mixed material of any of thesematerials, by a plasma CVD method, a sputtering method, or the like.Note that the base insulating layer 436 preferably has a single-layerstructure or a stacked-layer structure including an oxide insulatinglayer so that the oxide insulating layer is in contact with the oxidesemiconductor layer 403 to be formed later. Note that the baseinsulating layer 436 is not necessarily provided.

The base insulating layer 436 preferably includes an oxygen-excessregion, in which case oxygen vacancies in the oxide semiconductor layer403 to be formed later can be filled with the excess oxygen included inthe base insulating layer 436. In the case where the base insulatinglayer 436 has a stacked-layer structure, the base insulating layer 436preferably includes an oxygen-excess region at least in a layer incontact with the oxide semiconductor layer 403 (preferably, the oxideinsulating layer). In order to provide the oxygen-excess region in thebase insulating layer 436, for example, the base insulating layer 436may be formed in an oxygen atmosphere. Alternatively, the oxygen-excessregion may be formed by introducing oxygen (including at least one of anoxygen radical, an oxygen atom, and an oxygen ion) into the baseinsulating layer 436 after its formation. Oxygen can be introduced by anion implantation method, an ion doping method, a plasma immersion ionimplantation method, plasma treatment, or the like.

Further, the base insulating layer 436 preferably includes a siliconnitride film, a silicon nitride oxide film, or an aluminum oxide filmthat is in contact with the bottom side of the layer including theoxygen-excess region. In the case where the base insulating layer 436includes a silicon nitride film, a silicon nitride oxide film, or analuminum oxide film, diffusion of impurities into the oxidesemiconductor layer 403 can be prevented.

Planarizing treatment may be performed on the region of the baseinsulating layer 436 which is in contact with the oxide semiconductorlayer 403. As the planarizing treatment, polishing treatment (e.g., achemical mechanical polishing method), dry-etching treatment, or plasmatreatment can be used, though there is no particular limitation on theplanarizing treatment.

As the plasma treatment, reverse sputtering in which an argon gas isintroduced and plasma is generated can be performed. The reversesputtering is a method in which voltage is applied to a substrate sidewith use of an RF power source in an argon atmosphere and plasma isgenerated in the vicinity of the substrate so that a substrate surfaceis modified. Note that instead of an argon atmosphere, a nitrogenatmosphere, a helium atmosphere, an oxygen atmosphere, or the like maybe used. The reverse sputtering can remove particle substances (alsoreferred to as particles or dust) attached to a surface of the baseinsulating layer 436.

As the planarizing treatment, polishing treatment, dry etchingtreatment, or plasma treatment may be performed plural times, or thesetreatments may be performed in combination. In the case where thetreatments are combined, the order of steps is not particularly limitedand may be set as appropriate depending on the roughness of the surfaceof the base insulating layer 436.

In order to reduce impurities such as hydrogen including water and ahydroxyl group and make the base insulating layer 436 an oxygen-excesslayer, heat treatment (dehydration or dehydrogenation) to removehydrogen including water and a hydroxyl group and/or oxygen dopingtreatment may be performed on the base insulating layer 436. Thedehydration or dehydrogenation and the oxygen doping treatment each maybe performed plural times, and may be combined and repeated.

Next, an oxide semiconductor layer is deposited over the base insulatinglayer 436 and processed into an island shape to form the oxidesemiconductor layer 403 (see FIG. 2A). The oxide semiconductor layer 403has a thickness of, for example, 1 nm to 30 nm, preferably, 5 nm to 10nm.

The oxide semiconductor layer may have either a single-layer structureor a stacked-layer structure. Further, the oxide semiconductor layer mayhave either an amorphous structure or a crystalline structure. In thecase where the oxide semiconductor layer has an amorphous structure,heat treatment may be performed on the oxide semiconductor layer in alater manufacturing step so that the oxide semiconductor layer hascrystallinity. The heat treatment for crystallizing the amorphous oxidesemiconductor layer is performed at a temperature higher than or equalto 250° C. and lower than or equal to 700° C., preferably higher than orequal to 400° C., further preferably higher than or equal to 500° C.,still further preferably higher than or equal to 550° C. Note that theheat treatment can also serve as another heat treatment in themanufacturing process.

The oxide semiconductor layer can be formed by a sputtering method, amolecular beam epitaxy (MBE) method, a CVD method, a pulse laserdeposition method, an atomic layer deposition (ALD) method, or the likeas appropriate.

In the formation of the oxide semiconductor layer, the hydrogenconcentration in the oxide semiconductor layer is preferably reduced asmuch as possible. In order to reduce the hydrogen concentration, forexample, in the case where a sputtering method is used for thedeposition, a high-purity rare gas (typically, argon) from whichimpurities such as hydrogen, water, a hydroxyl group, and hydride havebeen removed; oxygen; or a mixed gas of oxygen and the rare gas is usedas appropriate as an atmosphere gas supplied to a deposition chamber ofa sputtering apparatus.

The oxide semiconductor layer is formed in such a manner that asputtering gas from which hydrogen and moisture are removed isintroduced into the deposition chamber while moisture remaining in thedeposition chamber is removed, whereby the concentration of hydrogen inthe oxide semiconductor layer can be reduced. In order to removemoisture remaining in the deposition chamber, an entrapment vacuum pumpsuch as a cryopump, an ion pump, or a titanium sublimation pump ispreferably used. The evacuation unit may be a turbo molecular pumpprovided with a cold trap. When the deposition chamber is evacuated withthe cryopump, which has a high capability in removing a hydrogenmolecule, a compound containing a hydrogen atom such as water (H₂O)(more preferably, also a compound containing a carbon atom), and thelike, the impurity concentration in the oxide semiconductor layer formedin the deposition chamber can be reduced.

Further, when the oxide semiconductor layer is formed by a sputteringmethod, the relative density (filling rate) of a metal oxide target thatis used for the deposition is greater than or equal to 90% and less thanor equal to 100%, preferably greater than or equal to 95% and less thanor equal to 99.9%. With the use of a metal oxide target with a highrelative density, a dense oxide semiconductor layer can be deposited.

Further, to reduce the impurity concentration in the oxide semiconductorlayer, it is also effective to form the oxide semiconductor layer whilethe substrate 400 is kept at high temperature. The temperature at whichthe substrate 400 is heated may be higher than or equal to 150° C. andlower than or equal to 450° C.; the substrate temperature is preferablyhigher than or equal to 200° C. and lower than or equal to 350° C. Acrystalline oxide semiconductor layer can be formed by heating thesubstrate at a high temperature in the deposition.

Note that in the case where a CAAC-OS film is used as the oxidesemiconductor layer 403, for example, the CAAC-OS film can be formed bya sputtering method with a polycrystalline oxide semiconductorsputtering target. When ions collide with the sputtering target, acrystal region included in the sputtering target may be separated fromthe target along an a-b plane; in other words, a sputtered particlehaving a plane parallel to an a-b plane (flat-plate-like sputteredparticle or pellet-like sputtered particle) may flake off from thesputtering target. In that case, the flat-plate-like sputtered particlereaches a substrate while maintaining their crystal state, whereby theCAAC-OS film can be formed.

The flat-plate-like sputtered particle has, for example, a diameter of acircle corresponding to a plane that is parallel to an a-b plane greaterthan or equal to 3 nm and less than or equal to 10 nm and a thickness(length in the direction perpendicular to the a-b plane) greater than orequal to 0.7 nm and less than 1 nm. Note that in the flat-plate-likesputtered particle, the plane parallel to the a-b plane may be a regulartriangle or a regular hexagon. Here, the diameter of a circlecorresponding to a plane refers to a diameter of a perfect circle havingthe same area as the plane.

For the deposition of the CAAC-OS film, the following conditions arepreferably used.

By increasing the substrate temperature during the deposition, migrationof sputtered particles is likely to occur after the sputtered particlesreach a substrate surface. Specifically, the substrate temperatureduring the deposition is higher than or equal to 100° C. and lower thanor equal to 740° C., preferably higher than or equal to 200° C. andlower than or equal to 500° C. By increasing the substrate temperatureduring the deposition, when the flat-plate-like sputtered particlesreach the substrate, migration occurs on the substrate surface, so thata flat plane of the sputtered particles is attached to the substrate. Atthis time, the sputtered particles are positively charged, whereby thesputtered particles repelling each other are attached to the substrate.Therefore, the sputtered particles are not gathered and are not unevenlyoverlapped with each other, so that the CAAC-OS film having a uniformthickness can be formed.

By reducing the amount of impurities entering the CAAC-OS film duringthe deposition, the crystal state can be prevented from being broken bythe impurities. For example, the concentration of impurities (e.g.,hydrogen, water, carbon dioxide, or nitrogen) which exist in thedeposition chamber may be reduced. Furthermore, the concentration ofimpurities in a deposition gas may be reduced. Specifically, adeposition gas whose dew point is −80° C. or lower, preferably −100° C.or lower is used.

Furthermore, it is preferable that the proportion of oxygen in thedeposition gas be increased and the power be optimized in order toreduce plasma damage at the deposition. The proportion of oxygen in thedeposition gas is 30 vol % or higher, preferably 100 vol %.

Heat treatment may be performed after the CAAC-OS film is deposited. Thetemperature of the heat treatment is higher than or equal to 100° C. andlower than or equal to 740° C., preferably higher than or equal to 200°C. and lower than or equal to 500° C. Further, the heat treatment timeis longer than or equal to 1 minute and shorter than or equal to 24hours, preferably longer than or equal to 6 minutes and shorter than orequal to 4 hours. Further, the heat treatment may be performed in aninert atmosphere or an oxidizing atmosphere. The heat treatment ispreferably performed in such a manner that heat treatment is performedin an inert atmosphere and then heat treatment is performed in anoxidizing atmosphere. The heat treatment in an inert atmosphere canreduce the concentration of impurities in the CAAC-OS film in a shorttime. Meanwhile, through the heat treatment in an inert atmosphere,oxygen vacancies are generated in the CAAC-OS film in some cases. Inthat case, through the heat treatment in an oxidizing atmosphere, theoxygen vacancies can be reduced. Further, the heat treatment can furtherimprove the crystallinity of the CAAC-OS film. Note that the heattreatment may be performed under a reduced pressure of 1000 Pa or less,100 Pa or less, 10 Pa or less, or 1 Pa or less. The heat treatment undera reduced pressure can reduce the concentration of impurities in theCAAC-OS film in a shorter time.

Further, another method for forming the CAAC-OS film is to form a thinoxide semiconductor film and then subject the film to heat treatmentperformed at a temperature higher than or equal to 200° C. and lowerthan or equal to 700° C., thereby obtaining c-axis alignmentsubstantially perpendicular to a surface. Furthermore, another method isto form a first thin oxide semiconductor film, subject the film to heattreatment performed at a temperature higher than or equal to 200° C. andlower than or equal to 700° C., and then form a second oxidesemiconductor film, thereby obtaining c-axis alignment substantiallyperpendicular to a surface.

As an example of the sputtering target, an In—Ga—Zn—O compound target isdescribed below.

The In—Ga—Zn—O compound target, which is polycrystalline, is made bymixing InO_(X) powder, GaO_(Y) powder, and ZnO_(Z) powder in apredetermined molar ratio, applying pressure, and performing heattreatment at a temperature higher than or equal to 1000° C. and lowerthan or equal to 1500° C. Note that X, Y, and Z are each a givenpositive number. Here, the predetermined molar ratio of InO_(X) powderto GaO_(Y) powder and ZnO_(Z) powder is, for example, 2:2:1, 8:4:3,3:1:1, 1:1:1, 4:2:3, or 3:1:2. The kinds of powder and the molar ratiofor mixing powder may be determined as appropriate depending on thedesired sputtering target.

An oxide semiconductor used for the oxide semiconductor layer 403contains at least indium (In). In particular, indium and zinc (Zn) arepreferably contained. In addition, as a stabilizer for reducingvariation in electric characteristics of a transistor using the oxidesemiconductor, the oxide semiconductor preferably contains gallium (Ga)in addition to In and Zn. It is preferable that one or more elementsselected from tin (Sn), hafnium (Hf), aluminum (Al), and zirconium (Zr)be contained as a stabilizer.

As another stabilizer, one or plural kinds of lanthanoid such aslanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), samarium(Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy),holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), or lutetium(Lu) may be contained.

As the oxide semiconductor, for example, any of the following can beused: indium oxide; tin oxide; zinc oxide; a two-component metal oxidesuch as an In—Zn-based oxide, an In—Mg-based oxide, or an In—Ga-basedoxide; a three-component metal oxide such as an In—Ga—Zn-based oxide(also referred to as IGZO), an In—Al—Zn-based oxide, an In—Sn—Zn-basedoxide, an In—Hf—Zn-based oxide, an In—La—Zn-based oxide, anIn—Ce—Zn-based oxide, an In—Pr—Zn-based oxide, an In—Nd—Zn-based oxide,an In—Sm—Zn-based oxide, an In—Eu—Zn-based oxide, an In—Gd—Zn-basedoxide, an In—Tb—Zn-based oxide, an In—Dy—Zn-based oxide, anIn—Ho—Zn-based oxide, an In—Er—Zn-based oxide, an In—Tm—Zn-based oxide,an In—Yb—Zn-based oxide, or an In—Lu—Zn-based oxide; a four-componentmetal oxide such as an In—Sn—Ga—Zn-based oxide, an In—Hf—Ga—Zn-basedoxide, an In—Al—Ga—Zn-based oxide, an In—Sn—Al—Zn-based oxide, anIn—Sn—Hf—Zn-based oxide, or an In—Hf—Al—Zn-based oxide.

For example, an “In—Ga—Zn-based oxide” means an oxide containing In, Ga,and Zn as its main component, in which there is no particular limitationon the ratio of In:Ga:Zn. The In—Ga—Zn-based oxide may contain a metalelement other than the In, Ga, and Zn.

Alternatively, a material represented by InMO₃(ZnO)_(m) (m>0 issatisfied, and m is not an integer) may be used as an oxidesemiconductor. Note that M represents one or more metal elementsselected from Ga, Fe, Mn, and Co. Alternatively, as the oxidesemiconductor, a material expressed by a chemical formula,In₂SnO₅(ZnO)_(n) (n>0, n is a natural number) may be used.

For example, an In—Ga—Zn-based oxide with an atomic ratio ofIn:Ga:Zn=1:1:1 (=1/3:1/3:1/3), In:Ga:Zn=2:2:1 (=2/5:2/5:1/5),In:Ga:Zn=3:1:2 (=1/2:1/6:1/3),or any of oxides whose composition is inthe neighborhood of the above compositions can be used. Alternatively,an In—Sn—Zn-based oxide with an atomic ratio of In:Sn:Zn=1:1:1(=1/3:1/3:1/3), In:Sn:Zn=2:1:3 (=1/3:1/6:1/2), or In:Sn:Zn=2:1:5(=1/4:1/8:5/8), or any of oxides whose composition is in theneighborhood of the above compositions may be used.

However, an oxide semiconductor containing indium that is included in atransistor is not limited to the materials given above; a material withan appropriate composition may be used for a transistor including anoxide semiconductor containing indium depending on needed electricalcharacteristics (e.g., field-effect mobility, threshold voltage, andvariation). In order to obtain the needed electrical characteristics,the carrier concentration, the impurity concentration, the defectdensity, the atomic ratio between a metal element and oxygen, theinteratomic distance, the density, and the like are preferably set toappropriate values.

For example, high field-effect mobility can be obtained relativelyeasily in a transistor including an In—Sn—Zn-based oxide semiconductor.Also in the case of a transistor including an In—Ga—Zn-based oxidesemiconductor, the field-effect mobility can be increased by reducingthe defect density in a bulk.

Note that for example, the expression “the composition of an oxideincluding In, Ga, and Zn at the atomic ratio, In:Ga:Zn=a:b:c (a+b+c=1),is in the neighborhood of the composition of an oxide containing In, Ga,and Zn at the atomic ratio, In:Ga:Zn=A:B:C (A+B+C=1)” means that a, b,and c satisfy the following relation: (a−A)²+(b−B)²+(c−C)²≤r². Forexample, r may be 0.05. The same applies to other oxides.

In this embodiment, the oxide semiconductor layer 403 has a single-layerstructure. Note that the oxide semiconductor layer 403 may have astacked-layer structure of a plurality of oxide semiconductor layers.For example, the oxide semiconductor layer 403 may have a stacked-layerstructure of a first oxide semiconductor layer and a second oxidesemiconductor layer which are formed using metal oxides with differentcompositions. For example, the first oxide semiconductor layer may beformed using a three-component metal oxide and the second oxidesemiconductor layer may be formed using a two-component metal oxide.Alternatively, for example, both the first oxide semiconductor layer andthe second oxide semiconductor layer may be formed using athree-component metal oxide.

Further, the constituent elements of the first oxide semiconductor layerand the second oxide semiconductor layer are made to be the same and thecomposition of the constituent elements of the first oxide semiconductorfilm and the second oxide semiconductor film may be made to bedifferent. For example, the atomic ratio of the first oxidesemiconductor layer may be In:Ga:Zn=1:1:1 and the atomic ratio of thesecond oxide semiconductor layer may be In:Ga:Zn=3:1:2. Alternatively,the atomic ratio of the first oxide semiconductor layer may beIn:Ga:Zn=1:3:2 and the atomic ratio of the second oxide semiconductorlayer may be In:Ga:Zn=2:1:3.

At this time, one of the first oxide semiconductor layer and the secondoxide semiconductor layer which is closer to a gate electrode (on achannel side) preferably contains In and Ga at a proportion of In>Ga.The other which is farther from the gate electrode (on a back channelside) preferably contains In and Ga at a proportion of In≤Ga.

In an oxide semiconductor, the s orbitals of heavy metal mainlycontribute to carrier transfer, and when the In content in the oxidesemiconductor is increased, overlap of the s orbitals is likely to beincreased. Therefore, an oxide having a composition of In>Ga has highermobility than an oxide having a composition of In≤Ga. Further, in Ga,the formation energy of oxygen vacancies is larger and thus oxygenvacancies are less likely to occur, than in In; therefore, the oxidehaving a composition of In≤Ga has more stable characteristics than theoxide having a composition of In>Ga.

An oxide semiconductor containing In and Ga at a proportion of In>Ga isused on a channel side, and an oxide semiconductor containing In and Gaat a proportion of In≤Ga is used on a back channel side; so thatmobility and reliability of a transistor can be further improved.

Further, oxide semiconductors having different crystallinities may beused for the first oxide semiconductor layer and the second oxidesemiconductor layer. That is, two of a single crystal oxidesemiconductor, a polycrystalline oxide semiconductor, an amorphous oxidesemiconductor, and a CAAC-OS may be combined as appropriate. When anamorphous oxide semiconductor is used for at least one of the firstoxide semiconductor layer and the second oxide semiconductor layer,internal stress or external stress of the oxide semiconductor layer 403is relieved, variation in characteristics of a transistor is reduced,and reliability of the transistor can be further improved.

On the other hand, an amorphous oxide semiconductor is likely to absorban impurity which serves as a donor, such as hydrogen, and to generatean oxygen vacancy, and thus easily becomes an n-type. Thus, the oxidesemiconductor layer on the channel side is preferably formed using acrystalline oxide semiconductor such as a CAAC-OS.

Further, the oxide semiconductor layer 403 is preferably subjected toheat treatment for removing excess hydrogen, including water and ahydroxyl group, (dehydration or dehydrogenation) contained in the oxidesemiconductor layer 403. The temperature of the heat treatment is higherthan or equal to 300° C. and lower than or equal to 700° C., or lowerthan the strain point of the substrate. The heat treatment can beperformed under reduced pressure, a nitrogen atmosphere, or the like.

Hydrogen, which is an impurity imparting n-type conductivity, can beremoved from the oxide semiconductor by the heat treatment. For example,the hydrogen concentration in the oxide semiconductor layer 403 afterthe dehydration or dehydrogenation treatment can be lower than or equalto 5×10¹⁹/cm⁻³, preferably lower than or equal to 5×10¹⁸/cm⁻³.

Note that the heat treatment for the dehydration or dehydrogenation maybe performed at any timing in the manufacturing process of thetransistor 420 as long as the heat treatment is performed after theformation of the oxide semiconductor layer. The heat treatment fordehydration or dehydrogenation may be performed plural times, and mayalso serve as another heat treatment.

Note that in the case where an insulating layer containing oxygen isprovided as the base insulating layer 436, the heat treatment fordehydration or dehydrogenation is preferably performed before the oxidesemiconductor layer is processed into an island shape because oxygencontained in the base insulating layer 436 can be prevented from beingreleased by the heat treatment.

In the heat treatment, it is preferable that water, hydrogen, or thelike be not contained in nitrogen or a rare gas such as helium, neon, orargon. The purity of nitrogen or the rare gas such as helium, neon, orargon which is introduced into the heat treatment apparatus is set topreferably 6N (99.9999%) or higher, further preferably 7N (99.99999%) orhigher (that is, the impurity concentration is preferably 1 ppm orlower, further preferably 0.1 ppm or lower).

In addition, after the oxide semiconductor layer 403 is heated by theheat treatment, a high-purity oxygen gas, a high-purity N₂O gas, orultra dry air (the moisture amount is less than or equal to 20 ppm (−55°C. by conversion into a dew point), preferably less than or equal to 1ppm, more preferably less than or equal to 10 ppb, in the measurementwith the use of a dew point meter of a cavity ring down laserspectroscopy (CRDS) system) may be introduced into the same furnacewhile the heating temperature is being maintained or being graduallydecreased. It is preferable that water, hydrogen, or the like be notcontained in the oxygen gas or the dinitrogen monoxide gas. The purityof the oxygen gas or the dinitrogen monoxide gas which is introducedinto the heat treatment apparatus is preferably 6N or higher, furtherpreferably 7N or higher (i.e., the impurity concentration in the oxygengas or the dinitrogen monoxide gas is preferably 1 ppm or lower, furtherpreferably 0.1 ppm or lower). The oxygen gas or the dinitrogen monoxidegas acts to supply oxygen that is a main component of the oxidesemiconductor and that is reduced by the step for removing an impurityby the dehydration or dehydrogenation treatment, so that the oxidesemiconductor layer 403 can be a high-purified and i-type (intrinsic)oxide semiconductor layer.

Since there is a possibility that oxygen, which is a main component ofan oxide semiconductor, is also released and reduced by dehydration ordehydrogenation treatment, oxygen (including at least one of an oxygenradical, an oxygen atom, and an oxygen ion) may be introduced to theoxide semiconductor layer which has been subjected to the dehydration ordehydrogenation treatment to supply oxygen to the layer.

Introduction (supply) of oxygen into the dehydrated or dehydrogenatedoxide semiconductor layer enables the oxide semiconductor layer to behighly purified and to be i-type (intrinsic). Variation in electriccharacteristics of a transistor having the highly-purified and i-type(intrinsic) oxide semiconductor is suppressed, and the transistor iselectrically stable.

When oxygen is introduced into the oxide semiconductor layer, oxygen maybe directly introduced into the oxide semiconductor layer or may beintroduced into the oxide semiconductor layer 403 through another filmsuch as the gate insulating layer 402 or the insulating layer 407 to beformed later. When oxygen is introduced into the oxide semiconductorlayer 403 through another film, an ion implantation method, an iondoping method, a plasma immersion ion implantation method, or the likemay be used. In the case of directly introducing oxygen into the exposedoxide semiconductor layer 403, plasma treatment or the like can be usedin addition to the above-described methods.

As a gas for supplying oxygen, a gas containing O may be used; forexample, an O₂ gas, an N₂O gas, a CO₂ gas, a CO gas, or an NO₂ gas maybe used. Note that a rare gas (e.g., argon) may be contained in a gasfor supplying oxygen.

For example, in the case where an oxygen ion is implanted into the oxidesemiconductor layer 403 by an ion implantation method, the dosage may beset to be greater than or equal to 1×10¹³ ions/cm² and less than orequal to 5×10¹⁶ ions/cm².

Alternatively, oxygen may be supplied to the oxide semiconductor layer403 in a manner such as the following: a layer including anoxygen-excess region is used as the insulating layer which is in contactwith the oxide semiconductor layer 403; heat treatment is performed in astate where the insulating layer and the oxide semiconductor layer 403are in contact with each other, whereby oxygen excessively contained inthe insulating layer is diffused into the oxide semiconductor layer 403.The heat treatment may serve as another heat treatment in themanufacturing process of the transistor 420.

The supply of oxygen to the oxide semiconductor layer can be performedanytime after the formation of the oxide semiconductor layer. The stepof introducing oxygen into the oxide semiconductor layer may beperformed plural times. Further, in the case where the oxidesemiconductor layer has a stacked-layer structure consisting of aplurality of layers, the heat treatment and/or the supply of oxygen fordehydration or dehydrogenation may be separately performed for everyoxide semiconductor layer or may be performed on the oxide semiconductorlayer 403 having a stacked-layer structure.

The base oxide insulating layer 436 and the oxide semiconductor layer403 are preferably formed in succession without exposure to the air.According to successive formation of the base insulating layer 436 andthe oxide semiconductor layer 403 without exposure to the air,impurities such as hydrogen and moisture can be prevented from beingadsorbed onto a surface of the base insulating layer 436.

The oxide semiconductor layer 403 can be formed by processing an oxidesemiconductor film into an island shape by a photolithography step. Notethat a resist mask used for formation of the island-shaped oxidesemiconductor layer 403 may be formed by an inkjet method. Formation ofthe resist mask by an inkjet method needs no photomask; thus,manufacturing cost can be reduced.

Next, a gate insulating film 402 a is formed to cover the oxidesemiconductor layer 403 (see FIG. 2B). For example, the gate insulatingfilm 402 a can be formed to have a thickness greater than or equal to 1nm and less than or equal to 20 nm by a sputtering method, an MBEmethod, a CVD method, a pulse laser deposition method, an ALD method, orthe like as appropriate.

To improve the coverage with the gate insulating film 402 a, theabove-described planarizing treatment may be performed also on a surfaceof the oxide semiconductor layer 403. In particular, in the case where athin insulating layer is used as the gate insulating film 402 a, it ispreferable that the oxide semiconductor layer 403 have improved surfaceflatness.

The gate insulating film 402 a can be formed using a silicon oxide film,a gallium oxide film, an aluminum oxide film, a silicon nitride film, asilicon oxynitride film, an aluminum oxynitride film, or a siliconnitride oxide film. It is preferable that the gate insulating film 402 ainclude oxygen in a portion which is in contact with the oxidesemiconductor layer 403. In particular, the gate insulating film 402 apreferably contains a large amount of oxygen which exceeds at least theamount of oxygen in the stoichiometric ratio in the film (bulk). Forexample, in the case where a silicon oxide film is used as the gateinsulating film 402 a, the composition formula is SiO_(2+α) (α>0).Further, the gate insulating film 402 a is preferably formed inconsideration of the size of a transistor to be formed and the stepcoverage with the gate insulating film 402 a.

The gate insulating film 402 a can be formed using hafnium oxide,yttrium oxide, hafnium silicate (HfSi_(x)O_(y) (x>0, y>0)), hafniumsilicate to which nitrogen is added, hafnium aluminate (HfAl_(x)O_(y)(x>0, y>0)), lanthanum oxide, or the like. Further, the gate insulatingfilm 402 a may have a single-layer structure or a stacked-layerstructure.

In order to reduce impurities such as hydrogen including water and ahydroxyl group and make the gate insulating film 402 a an oxygen-excessfilm, heat treatment (dehydration or dehydrogenation) to remove hydrogenincluding water and a hydroxyl group and/or oxygen doping treatment maybe performed on the gate insulating film 402 a. The dehydration ordehydrogenation and the oxygen doping treatment each may be performedplural times, and may be combined and repeated.

Then, a conductive film is formed over the gate insulating film 402 aand then etched, so that the gate electrode layer 401 is formed.Further, the gate insulating film 402 a is etched using the gateelectrode layer 401 as a mask or the same mask as that used for theformation of the gate electrode layer 401 to form a gate insulatinglayer 402 (see FIG. 2C).

The gate electrode layer 401 can be formed using a metal material suchas molybdenum, titanium, tantalum, tungsten, aluminum, copper, chromium,neodymium, or scandium or an alloy material which contains any of thesematerials as its main component. A semiconductor film which is dopedwith an impurity element such as phosphorus and is typified by apolycrystalline silicon film, or a silicide film of nickel silicide orthe like can also be used as the gate electrode layer 401. The gateelectrode layer 401 may have either a single-layer structure or astacked-layer structure.

The gate electrode layer 401 can also be formed using a conductivematerial such as indium oxide-tin oxide, indium oxide containingtungsten oxide, indium zinc oxide containing tungsten oxide, indiumoxide containing titanium oxide, indium tin oxide containing titaniumoxide, indium oxide-zinc oxide, or indium tin oxide to which siliconoxide is added. It is also possible that the gate electrode layer 401has a stacked-layer structure of the above conductive material and theabove metal material.

As one layer of the gate electrode layer 401 which is in contact withthe gate insulating layer 402, a metal oxide containing nitrogen,specifically, an In—Ga—Zn—O film containing nitrogen, an In—Sn—O filmcontaining nitrogen, an In—Ga—O film containing nitrogen, an In—Zn—Ofilm containing nitrogen, a Sn—O film containing nitrogen, an In—O filmcontaining nitrogen, or a metal nitride (e.g., InN or SnN) film can beused. Such a film has a work function higher than or equal to 5 eV(electron volts), preferably higher than or equal to 5.5 eV (electronvolts), and the use of this film as the gate electrode layer enables thethreshold voltage of electrical characteristics of a transistor to bepositive. Accordingly, a normally-off switching element can be obtained.

Note that in a cross section in the channel width direction (crosssection illustrated in FIG. 1C), it is preferable that the distancebetween the end portion of the island-shaped oxide semiconductor layer403 and the end portions of the gate electrode layer 401 and the gateinsulating layer 402 be large because generation of a parasitic channelcan be suppressed.

Next, a metal film 410 is formed to cover the oxide semiconductor layer403, the gate insulating layer 402, and the gate electrode layer 401(see FIG. 3A).

When the metal film 410 is doped with oxygen in a later step, aninsulating metal oxide film is formed, which functions as a barrier filmin the transistor after being selectively etched. For the insulatingmetal oxide, a film having a lower oxygen-transmitting property than thegate insulating layer 402 can be used. Further, a film having a highshielding effect (blocking effect) of preventing penetration of bothoxygen and impurities such as hydrogen and moisture into the transistor420 is preferably used. Furthermore, the metal film 410 that is to be aninsulating metal oxide film can have a single-layer structure or astacked-layer structure of an aluminum film, an aluminum film to whichmagnesium is added, an aluminum film to which titanium is added, amagnesium film, or a titanium film.

The metal film 410 is preferably formed by a sputtering method, anevaporation method, a CVD method, or the like. The metal film 410preferably has a thickness greater than or equal to 5 nm and less thanor equal to 10 nm, further preferably greater than or equal to 5 nm andless than or equal to 7 nm. With the thickness of the metal film 410being greater than or equal to 5 nm, when the metal film 410 becomes aninsulating layer 411 in a later manufacturing step, a sufficient barriereffect can be obtained. Further, with the thickness of the metal film410 being less than or equal to 10 nm, a pattern of an insulating film411 a can be easily formed in a later manufacturing step.

Next, treatment for introducing oxygen 431 (also referred to as oxygendoping treatment or oxygen implantation treatment) is performed on themetal film 410. In such a manner, the metal film 410 is oxidized to formthe insulating film 411 a that is an insulating metal oxide film (seeFIG. 3B).

Note that the above-described “oxygen doping” means that oxygen (whichincludes at least one of an oxygen radical, an oxygen atom, an oxygenmolecule, an ozone, an oxygen ion (an oxygen molecule ion), and/or anoxygen cluster ion) is added to a bulk. Note that the term “bulk” isused in order to clarify that oxygen is added not only to a surface of athin film but also to the inside of the thin film. In addition, “oxygendoping” includes “oxygen plasma doping” in which oxygen which is made tobe plasma is added to a bulk.

As a gas for supplying oxygen, a gas containing O may be used; forexample, an O₂ gas, an N₂O gas, a CO₂ gas, a CO gas, or an NO₂ gas maybe used. Note that a rare gas (e.g., argon) may be contained in a gasfor supplying oxygen.

Here, in the case where the oxide semiconductor layer 403 is the CAAC-OSfilm, depending on the conditions for the oxygen doping treatment, acrystal structure of the crystalline components may be disordered in aregion of the oxide semiconductor layer 403 in contact with the thinmetal film 410 due to the introduction of the oxygen 431, whereas acrystal structure of the crystalline components is not damaged in aregion of the oxide semiconductor layer 403 overlapping with the gateelectrode layer 401 and the gate insulating layer 402. Therefore, in theregion in contact with the insulating film 411 a in the oxidesemiconductor layer 403 after the oxygen doping treatment, the secondregions 403 b in which the ratio of the crystalline components to theamorphous components is lower than that of the first region 403 a incontact with the gate insulating layer 402 may be formed. Alternatively,the crystalline components in the region of the oxide semiconductorlayer 403 in contact with the insulating film 411 a might be damaged tobecome amorphous. Further, when the oxide semiconductor layer 403 beforethe oxygen doping treatment is performed is a film having crystallinitysuch as a single crystal film or a polycrystalline film, a crystalstructure of the crystals in the region in contact with the insulatingfilm 411 a is disordered due to the oxygen doping treatment, whereby thecrystallinity is lowered and the region of the oxide semiconductor layer403 in contact with the insulating film 411 a can become amorphous insome cases.

In this embodiment, the case where the second regions 403 b having adisordered crystal structure (or an amorphized structure) are formed inthe oxide semiconductor layer 403 is described as an example. When thecrystal structure of the crystalline components included in the secondregions 403 b is disordered or the second regions 403 b becomesamorphous, dangling bonds, distortion between lattices, voids, or oxygenvacancies in the second regions 403 b are increased. Note that in thedrawing, the case where the second regions 403 b are formed entirely inthe thickness direction of the oxide semiconductor layer 403 isillustrated; however, this embodiment of the present invention is notlimited thereto. For example, the second regions 403 b may be formed toonly a depth of several nanometers from a surface of the oxidesemiconductor layer 403.

The dangling bonds, the distortion between lattices, the voids, or theoxygen vacancies in the second regions 403 b can be used as getteringsites of hydrogen. By the heat of heat treatment on the oxidesemiconductor layer 403, hydrogen included in the first region 403 a ofthe oxide semiconductor layer 403 moves and the hydrogen is drawn to thesecond regions 403 b.

The heat treatment for gettering hydrogen into the second regions 403 bof the oxide semiconductor layer 403 may be performed at a temperaturehigher than or equal to 100° C. and lower than or equal to the strainpoint of the substrate, preferably higher than or equal to 200° C. andlower than or equal to 650° C., for example. Through the heat treatment,the hydrogen included in the first region 403 a of the oxidesemiconductor layer 403 is drawn to the second regions 403 b and isgettered by the gettering sites, so that the hydrogen concentration inthe first region 403 a can be reduced. Further, since the hydrogengettered in the second regions 403 b of the oxide semiconductor layer403 is stable, the hydrogen is not easily diffused in the first region403 a again. Therefore, the hydrogen concentration in the second regions403 b of the oxide semiconductor layer 403 is increased as compared withthat of the first region 403 a. By an increase in the hydrogenconcentration in the second regions 403 b, conductivity of the secondregions 403 b can be higher than that of the first region 403 a.Therefore, the second regions 403 b of the oxide semiconductor layer 403can serve as low-resistance regions.

Note that the heat treatment for gettering hydrogen into the secondregions 403 b may be performed after a source electrode layer 405 a anda drain electrode layer 405 b are formed or before and after the sourceelectrode layer 405 a and the drain electrode layer 405 b are formed.Further, the heat treatment for gettering hydrogen from the first region403 a to the second regions 403 b may be performed plural times and mayalso serve as another heat treatment.

In an oxide semiconductor, part of hydrogen serves as a donor to releaseelectrons as carriers. When the carrier concentration in the channelformation region of the oxide semiconductor layer 403 becomes high, achannel is formed without voltage application to the gate electrodelayer 401 and the threshold voltage shifts in the negative direction.Therefore, gettering of the hydrogen included in the first region 403 aserving as the channel formation region in the transistor 420 into thesecond regions 403 b is effective to control the threshold voltage ofthe transistor 420.

In this embodiment, the insulating film 411 a and the second regions 403b are formed in the same step; however, this embodiment of the presentinvention is not limited thereto and a step for forming the secondregions 403 b may be provided separately. For example, the crystalstructure of the crystalline components included in the regions notoverlapping with the gate electrode layer 401 and the gate electrodelayer 402 may be damaged by addition of a rare gas such as argon.Alternatively, the second regions 403 b may be formed by addition of adopant that is an element by which the conductivity of the oxidesemiconductor layer is changed. One or more elements selected from thefollowing can be used as the dopant: Group 15 elements (typical examplesthereof are phosphorus (P), arsenic (As), and antimony (Sb)), boron (B),aluminum (Al), tungsten (W), molybdenum (Mo), nitrogen (N), indium (In),gallium (Ga), fluorine (F), chlorine (CO, titanium (Ti), and zinc (Zn).Further alternatively, the regions may be N⁺ regions formed by additionof hydrogen.

Alternatively, the heat treatment may be performed after the metal film410 is formed, whereby a metal element included in the metal film 410,as the dopant, is diffused in a region of the oxide semiconductor layer403 which is in contact with the metal film 410 to form the secondregions 403 b.

In the case where the doping step for forming the second regions 403 bis provided separately from the step for forming the insulating film 411a, the doping step may be performed at any timing as long as the dopingstep is performed after the formation of the gate electrode layer 401and the gate insulating layer 402 and before the formation of thesidewall insulating layer 412. Note that the doping step may beperformed plural times. Further, in the case where the doping step forforming the second regions 403 b is provided separately from the stepfor forming the insulating film 411 a, the insulating film 411 a may beformed by a sputtering method using a metal oxide or metal nitridetarget without the formation of the metal film 410.

The second regions 403 b include more carriers than the first region 403a and are low-resistance regions. Provision of a pair of low-resistanceregions with a channel formation region provided therebetween leads torelaxation of an electric field applied to the channel formation regionbetween the pair of low-resistance regions.

Next, an insulating film 412 a is formed over the insulating film 411 a(see FIG. 3C).

For the insulating film 412 a, for example, silicon oxide, siliconnitride, silicon oxynitride, silicon nitride oxide, or the like can beused. Further, the insulating film 412 a is preferably formed by a CVDmethod such as an LPCVD method or plasma CVD method. In this embodiment,as the insulating film 412 a, a silicon oxide film is formed by a plasmaCVD method. A plasma CVD method, which enables the insulating film 412 ato be formed thick, is advantageous in productivity because attachmentor entry of dust or the like into a film at the film formation unlikelyoccur and the film can be formed at relatively high deposition rate.

Next, the insulating film 412 a is anisotropically etched to form thesidewall insulating layer 412 in a self-aligned manner (see FIG. 3D).

Next, a resist mask 435 is formed over the sidewall insulating layer 412and the insulating film 411 a (see FIG. 4A). The resist mask 435 isformed to overlap with the gate electrode layer 401 and to be in contactwith the sidewall insulating layer 412 provided on a side surface of thegate electrode layer 401 with the insulating film 411 a providedtherebetween. Although the sidewall insulating layer 412 may becompletely covered with the resist mask 435 or may be partly contactwith the resist mask 435, in cross sections in the channel lengthdirection and the channel width direction, the resist mask 435 is atleast provided to be in contact with two surfaces of the sidewallinsulating layer 412, which face each other with the gate electrodelayer 401 provided between the two surfaces.

Next, the insulating film 411 a is etched using the resist mask 435 andthe sidewall insulating layer 412 as masks to form the insulating layer411 (see FIG. 4B).

Note that in this embodiment, an example in which the insulating film411 a is etched using the sidewall insulating layer 412 as a mask, sothat end portions of the sidewall insulating layer 412 are aligned withend portions of the insulating layer 411 is described; however, thisembodiment of the present invention is not limited thereto. For example,in the case where the resist mask 435 covers an entire surface of thesidewall insulating layer 412 and is in contact with the insulating film411 a in the region overlapping with the second regions 403 b of theoxide semiconductor layer 403, by etching the insulating film 411 ausing the resist mask 435, the end portions of the insulating layer 411may extend beyond the end portions of the sidewall insulating layer 412.

The insulating layer 411 covers side surfaces of the gate insulatinglayer 402 in both the channel length direction and the channel widthdirection and has a function of preventing elimination of oxygen fromthe side surfaces of the gate insulating layer 402.

Next, an insulating layer 407 is formed over the oxide semiconductorlayer 403, the insulating layer 411, and the sidewall insulating layer412; openings are formed in the insulating layer 407 and then the sourceelectrode layer 405 a and the drain electrode layer 405 b which areelectrically connected to the oxide semiconductor layer 403 through theopenings are formed (see FIG. 4C).

The insulating layer 407 can have a single-layer structure or astacked-layer structure of an inorganic insulating film such as asilicon oxide film, a silicon oxynitride film, an aluminum oxide film,an aluminum oxynitride film, a gallium oxide film, a hafnium oxide film,a magnesium oxide film, a zirconium oxide film, a lanthanum oxide film,or a barium oxide film, which are formed by a plasma CVD method, asputtering method, an evaporation method, or the like. Further, as theinsulating layer 407, a planarization insulating film may be formed inorder to reduce surface roughness due to the transistor or an inorganicinsulating film and a planarization insulating film may be stacked. Asthe planarization insulating film, an organic material such as apolyimide-based resin, an acrylic-based resin, or abenzocyclobutene-based resin can be used. Besides the above organicmaterials, a low-dielectric constant material (a low-k material) or thelike can be used.

As a conductive film used for the source electrode layer 405 a and thedrain electrode layer 405 b, for example, a metal film containing anelement selected from Al, Cr, Cu, Ta, Ti, Mo, and W, or a metal nitridefilm containing any of the above elements as a component (e.g., atitanium nitride film, a molybdenum nitride film, or a tungsten nitridefilm) can be used. Alternatively, a film of a high-melting-point metalsuch as Ti, Mo, or W or a metal nitride film of any of these elements (atitanium nitride film, a molybdenum nitride film, or a tungsten nitridefilm) may be stacked on one of or both a bottom side and a top side of ametal film of Al, Cu, or the like. Further alternatively, the conductivefilm used for the source electrode layer 405 a and the drain electrodelayer 405 b may be formed using a conductive metal oxide. As theconductive metal oxide, indium oxide (In₂O₃), tin oxide (SnO₂), zincoxide (ZnO), indium oxide-tin oxide (In₂O₃—SnO₂), indium oxide-zincoxide (In₂O₃—ZnO), or any of these metal oxide materials in whichsilicon oxide is contained can be used.

For example, as the source electrode layer 405 a and the drain electrodelayer 405 b, a single layer of a molybdenum film, a stack of a tantalumnitride film and a copper film, a stack of a tantalum nitride film and atungsten film, or the like can be used.

The source electrode layer 405 a and the drain electrode layer 405 b arein contact with the second regions 403 b of the oxide semiconductorlayer 403. The structure in which the source electrode layer 405 a andthe drain electrode layer 405 b are in contact with the second regions403 b which are low-resistance regions leads to a reduction in contactresistance between the oxide semiconductor layer 403 and each of thesource electrode layer 405 a and the drain electrode layer 405 b.

Further, a conductive film used for the source electrode layer 405 a andthe drain electrode layer 405 b may be formed by sputtering with highelectric power. In this case, part of the oxide semiconductor layer 403,which is exposed in the openings, can become amorphous depending on theconditions for forming the conductive film; therefore, part of the oxidesemiconductor film can become selectively amorphous without increasingthe number of the steps.

Through the above steps, a semiconductor device having the transistor420 of this embodiment can be formed.

FIGS. 15A and 15B illustrate a variation of the transistor described inthis embodiment. FIG. 15A is a plan view of a transistor 434 and FIG.15B is a cross-sectional view taken along V2-W2 in FIG. 15A. Note thatin FIG. 15A, some components of the transistor 434 (e.g., an insulatinglayer 407, an insulating layer 416) are not illustrated for clarity.

The transistor 434 illustrated in FIGS. 15A and 15B is different fromthe transistor 420 described above in that at least the end portions ofthe oxide semiconductor layer 403 in the channel width direction arecovered with the insulating layer 416.

In the transistor 434, as the insulating layer 416, a film whichincludes an oxygen-excess region and has a thickness of approximately100 nm can be used. Specifically, a silicon oxide film including anoxygen-excess region, a silicon oxynitride film including anoxygen-excess region, or the like can be used. Further, the insulatinglayer 416 can be formed by a sputtering method or a CVD method; theinsulating layer 416 including an oxygen-excess region may be formedthrough the formation in an oxygen atmosphere or an oxygen-excess regioncan be formed by an oxygen doping treatment on the insulating layer 416after the formation of the insulating layer 416.

In the transistor 434, the end portions of the oxide semiconductor layer403 are covered with the insulating layer 416 including an oxygen-excessregion, whereby elimination of oxygen from the side surfaces of theoxide semiconductor layer 403 can be further suppressed and thus theinfluence of a parasitic channel can be suppressed.

In the transistor 420 and the transistor 434 described in thisembodiment, the end portions of the gate insulating layer 402 arecovered with the insulating layer 411 having a lower oxygen-transmittingproperty than the gate insulating layer 402 and a barrier property;therefore, elimination of oxygen from the gate insulating layer 402 andthe oxide semiconductor layer 403 can be suppressed. Accordingly, in thetransistor 420 and the transistor 434, the influence of a parasiticchannel can be suppressed and variation in electric characteristics issuppressed, so that the transistors can be electrically stable. Thus, byusing such transistors, a highly reliable semiconductor device can beprovided.

The methods and structures described in this embodiment can be combinedas appropriate with any of the methods and structures described in theother embodiments.

Embodiment 2

In this embodiment, a semiconductor device having a structure differentfrom that of the semiconductor device in Embodiment 1 will be describedwith reference to FIGS. 5A and 5B, FIGS. 6A to 6D, and FIGS. 7A to 7D.

The transistor 422 illustrated in FIG. 5A, in a manner similar to thatof the transistor 420, includes an oxide semiconductor layer 403provided over a substrate 400; a gate insulating layer 402 provided overthe oxide semiconductor layer 403; a gate electrode layer 401overlapping with the oxide semiconductor layer 403 with the gateinsulating layer 402 provided therebetween; an insulating layer 411being in contact with part of an upper surface of the oxidesemiconductor layer 403, covering a side surface of the gate insulatinglayer 402 and a side surface and an upper surface of the gate electrodelayer 401, and having a lower oxygen-transmitting property than the gateinsulating layer 402; a sidewall insulating layer 412 provided on theside surface of the gate electrode layer 401 with the insulating layer411 provided therebetween; and a source electrode layer 405 a and adrain electrode layer 405 b which are electrically connected to theoxide semiconductor layer 403.

Further, the transistor 422 may include a base insulating layer 436, aninsulating layer 407, an insulating layer 414, or a source wiring layer415 a and a drain wiring layer 415 b as its components. The sourcewiring layer 415 a is electrically connected to the source electrodelayer 405 a through an opening provided in the insulating layer 414 andin the insulating layer 407. Further, the drain wiring layer 415 b iselectrically connected to the drain electrode layer 405 b through anopening provided in the insulating layer 414 and the insulating layer407.

In the transistor 422, the source electrode layer 405 a and the drainelectrode layer 405 b are provided to be in contact with a side surfaceand part of an upper surface of the oxide semiconductor layer 403, aside surface of the insulating layer 411, and a side surface of thesidewall insulating layer 412. In the transistor 422, the whole region(the side surface and the upper surface) of the oxide semiconductorlayer 403 is covered with the source electrode layer 405 a and the drainelectrode layer 405 b which are metal films or the insulating layer 411which is a barrier film which transmits less oxygen and hydrogen.Therefore, in the oxide semiconductor layer 403 included in thetransistor 422, entry of water or hydrogen and elimination of oxygen issuppressed, which leads to an improvement in reliability of thetransistor 422.

A transistor 424 illustrated in FIG. 5B has a structure similar to thatof the transistor 422. A difference between the transistor 422 and thetransistor 424 is the shape of the sidewall insulating layer 412. In thetransistor 424, the sidewall insulating layer 412 is provided to coveran upper surface of the insulating layer 411.

An example of a method for manufacturing the transistor 422 is describedbelow with reference to FIGS. 6A to 6D.

After the insulating film 412 a is formed through steps similar to thoseillustrated in FIGS. 1A to 1C, FIGS. 2A to 2C, and FIGS. 3A to 3D,polishing (cutting or grinding) treatment is performed on the insulatingfilm 412 a to remove part of the insulating film 412 a so that an uppersurface of the insulating film 411 a is exposed. By the polishingtreatment, a part of the insulating film 412 a which overlaps the gateelectrode layer 401 is removed to form an insulating film 412 b havingan opening. For the polishing (cutting or grinding) treatment, chemicalmechanical polishing (CMP) treatment can be preferably used.

Note that the CMP treatment may be performed only once or plural times.When the CMP treatment is performed plural times, first polishing ispreferably performed with a high polishing rate followed by finalpolishing with a low polishing rate. By combining polishing withdifferent polishing rates, planarity of the surfaces of the insulatingfilm 412 b and the insulating film 411 a can be improved.

Note that in the case where the polishing treatment is performed untilthe insulating film 412 a is flat without exposing the insulating film411 a, through a manufacturing process similar to that of the transistor422 after the polishing treatment, the transistor 424 can be formed.

A resist mask 435 is formed over the insulating film 411 a and theinsulating film 412 b (see FIG. 6A).

With the resist mask 435, the insulating film 411 a and the insulatingfilm 412 b are etched to form the insulating film 411 and the sidewallinsulating layer 412 (see FIG. 6B).

Next, a conductive film is formed to cover the oxide semiconductor layer403, the insulating film 411, and the sidewall insulating layer 412; theconductive film is selectively etched using a resist mask formed througha photolithography process to form a conductive film 405. The conductivefilm 405 has a region overlapping with the insulating film 411. Afterthat, the insulating layer 407 is formed over the conductive film 405(see FIG. 6C).

For the conductive film 405, a material similar to those of the sourceelectrode layer 405 a and the drain electrode layer 405 b described inEmbodiment 1 can be used.

Next, polishing (cutting or grinding) treatment is performed on theinsulating layer 407 and the conductive film 405, and a part of theconductive film 405 which is the region overlapping with the insulatingfilm 411 is removed to form the source electrode layer 405 a and thedrain electrode layer 405 b. By the removal of a part of the conductivefilm 405 which is the region overlapping with the insulating film 411through the polishing treatment, the conductive film 405 can be dividedalong the channel length direction without using a resist mask;therefore, even when a transistor has a short channel length, the sourceelectrode layer 405 a and the drain electrode layer 405 b can be formedwith high accuracy.

After that, the insulating layer 414 is formed over the insulating layer407 and openings that reach the oxide semiconductor layer 403 are formedin the insulating layer 414 and the insulating layer 407. The sourcewiring layer 415 a which is electrically connected to the sourceelectrode layer 405 a and the drain wiring layer 415 b which iselectrically connected to the drain electrode layer 405 b are formed inthe openings (see FIG. 6D).

Further, in formation of a conductive film used for the source wiringlayer 415 a and the drain wiring layer 415 b, the conductive film may beformed by sputtering with high electric power. In this case, part of theoxide semiconductor layer 403, which is exposed in the openings, canbecome amorphous depending on the conditions for forming the conductivefilm; therefore, part of the oxide semiconductor film can becomeamorphous without increasing the number of the steps.

Through the above steps, a semiconductor device having the transistor422 of this embodiment can be manufactured.

FIGS. 7A and 7D illustrate a variation of the transistor of thisembodiment.

A transistor 426 illustrated in FIG. 7A is an example in which after thestep shown in FIG. 4B, a conductive film which is to be the sourceelectrode layer 405 a and the drain electrode layer 405 b is formed overthe oxide semiconductor layer 403, the insulating film 411, and thesidewall insulating layer 412, and the conductive film is etched using aresist mask formed through a photolithography process, whereby thesource electrode layer 405 a and the drain electrode layer 405 b areformed.

A transistor 428 illustrated in FIG. 7B, in a manner similar to that ofthe transistor 426, is an example in which after the step shown in FIG.4B, a conductive film which is to be the source electrode layer 405 aand the drain electrode layer 405 b is formed over the oxidesemiconductor layer 403, the insulating film 411, and the sidewallinsulating layer 412, and the conductive film is made to recede byetching using a resist mask formed through a photolithography process,whereby the source electrode layer 405 a and the drain electrode layer405 b are formed.

A transistor 430 illustrated in FIG. 7C is formed in the followingmanner, for example: in a manner similar to that of the transistor 426,after the step shown in FIG. 4B, a conductive film which is to be thesource electrode layer 405 a and the drain electrode layer 405 b isformed over the oxide semiconductor layer 403, the insulating film 411,and the sidewall insulating layer 412, and the conductive film isselectively etched using a resist mask formed through a photolithographyprocess. After that, the insulating layer 407 is formed over theconductive film which is selectively etched and polishing (cutting orgrinding) treatment is performed on the insulating layer 407 and theconductive film; thus a part of the conductive film which is a regionoverlapping with the gate electrode layer 401 is removed to form thesource electrode layer 405 a and the drain electrode layer 405 b. By theremoval of a part of the conductive film which is the region overlappingwith the gate electrode layer 401 through the polishing treatment, theconductive film can be divided in the channel length direction withoutusing a resist mask; therefore, even when a transistor has a shortchannel length, the source electrode layer 405 a and the drain electrodelayer 405 b can be formed with high accuracy.

A transistor 432 illustrated in FIG. 7D is an example in which thesource electrode layer 405 a and the drain electrode layer 405 b areprovided in regions not overlapping with the gate insulating layer 402.The transistor 432 is formed in the following manner, for example: afterthe step shown in FIG. 4B, a metal film (an aluminum film, a titaniumfilm, or the like) is formed over the oxide semiconductor layer 403, theinsulating film 411, and the sidewall insulating layer 412 by sputteringwith high electric power and thus a region of the oxide semiconductorlayer 403 which is in contact with the metal film is made amorphous;through heat treatment, a metal element is diffused in the oxidesemiconductor layer 403, whereby the resistance of the oxidesemiconductor layer 403 is reduced, so that an amorphous region 445 aserving as a source electrode layer and an amorphous region 445 bserving as a drain electrode layer are formed. Note that after theamorphous region 445 a and the amorphous region 445 b are formed, themetal film is removed.

In the transistor described in this embodiment, the distance between aregion where the source electrode layer 405 a and the oxidesemiconductor layer 403 are in contact with each other (source sidecontact region) and the gate electrode layer 401 and the distancebetween a region where the drain electrode layer 405 b and the oxidesemiconductor layer 403 are in contact with each other (drain sidecontact region) and the gate electrode layer 401 can be reduced.Therefore, the resistance between the source side contact region or thedrain side contact region and the gate electrode layer 401 can bereduced, so that the on-state characteristics can be improved.

In the transistor described in this embodiment, the sidewall insulatinglayer 412 has a function of suppressing formation of a parasitic channelbetween the source electrode layer 405 a or the drain electrode layer405 b and the gate electrode layer 401.

Further, in the transistor described in this embodiment, in a mannersimilar to that of the transistor described in Embodiment 1, the endportions of the gate insulating layer 402 are covered with theinsulating layer 411 having a barrier property against oxygen,preferably a barrier property against oxygen and hydrogen; therefore,elimination of oxygen from the gate insulating layer 402 and the oxidesemiconductor layer 403 and entry of hydrogen into the gate insulatinglayer 402 and the oxide semiconductor layer 403 can be suppressed. Thus,the oxide semiconductor layer 403 can be highly purified and become ani-type (intrinsic) semiconductor. Variation in electric characteristicsof a transistor having the highly-purified and i-type (intrinsic) oxidesemiconductor is suppressed, and the transistor is electrically stable.

The methods and structures described in this embodiment can be combinedas appropriate with any of the methods and structures described in theother embodiments.

Embodiment 3

In this embodiment, an example of a semiconductor device (memory device)which includes the transistor described in this specification, which canhold stored data even when not powered, and which has an unlimitednumber of write cycles will be described with reference to drawings.

FIGS. 8A to 8C illustrate an example of a structure of a semiconductordevice. FIG. 8A is a cross-sectional view of the semiconductor device,FIG. 8B is a plane view of the semiconductor device, and FIG. 8C is acircuit diagram of the semiconductor device. Here, FIG. 8A correspondsto a cross section along line C1-C2 and line D1-D2 in FIG. 8B.

The semiconductor device illustrated in FIGS. 8A and 8B includes atransistor 160 including a first semiconductor material in a lowerportion, and the transistor 162 including a second semiconductormaterial in an upper portion. The transistor 162 applies the structureof the transistor 426 shown in Embodiment 2 as an example.

Here, the first semiconductor material and the second semiconductormaterial are preferably materials having different band gaps. Forexample, the first semiconductor material may be a semiconductormaterial other than an oxide semiconductor (e.g., silicon) and thesecond semiconductor material may be an oxide semiconductor. Atransistor including a material other than an oxide semiconductor canoperate at high speed easily. On the other hand, a transistor includingan oxide semiconductor enables charge to be held for a long time owingto its characteristics.

Although all the transistors are n-channel transistors here, it isneedless to say that p-channel transistors can be used. The specificstructure of the semiconductor device, such as the material used for thesemiconductor device and the structure of the semiconductor device, isnot necessarily limited to those described here except for the use ofthe transistor described in Embodiment 1 or 2, which is formed using anoxide semiconductor for holding data.

The transistor 160 in FIG. 8A includes a channel formation region 116provided in a substrate 185 containing a semiconductor material (e.g.,silicon), impurity regions 120 provided so that the channel formationregion 116 is sandwiched therebetween, intermetallic compound regions124 in contact with the impurity regions 120, a gate insulating layer108 provided over the channel formation region 116, and a gate electrodelayer 110 provided over the gate insulating layer 108. Note that atransistor whose source electrode layer and drain electrode layer arenot illustrated in a drawing may be referred to as a transistor for thesake of convenience. Further, in such a case, in description of aconnection of a transistor, a source region and a source electrode layermay be collectively referred to as a source electrode layer, and a drainregion and a drain electrode layer may be collectively referred to as adrain electrode layer. That is, in this specification, the term “sourceelectrode layer” may include a source region.

Further, an element isolation insulating layer 106 is formed over thesubstrate 185 to surround the transistor 160, and an insulating layer128 and an insulating layer 130 are formed to surround the transistor160.

The transistor 160 formed using a single crystal semiconductor substratecan operate at high speed. Thus, when the transistor is used as areading transistor, data can be read at a high speed. As treatment priorto formation of the transistor 162 and a capacitor 164, CMP treatment isperformed on the insulating layer covering the transistor 160, wherebythe insulating layers 128 and 130 are planarized and, at the same time,an upper surface of the gate electrode layer of the transistor 160 isexposed.

The transistor 162 in FIG. 8A includes an oxide semiconductor in thechannel formation region and is a top-gate transistor. Here, the endportions of the gate insulating layer 140 included in the transistor 162are covered with the insulating layer 145 having a barrier propertyagainst oxygen and hydrogen. Therefore, elimination of oxygen from thegate insulating layer 140 and the oxide semiconductor layer 144 andentry of hydrogen into the gate insulating layer 140 and the oxidesemiconductor layer 144 can be suppressed; thus, the oxide semiconductorlayer 144 can be highly purified and become an i-type (intrinsic)semiconductor. The transistor 162 having the highly purified and i-type(intrinsic) oxide semiconductor has extremely favorable off-statecharacteristics. Further, in the transistor 162 described in thisembodiment, a sidewall insulating layer 146 can suppress formation of aparasitic channel between an electrode layer 142 a or an electrode layer142 b and a gate electrode layer 148 a.

Since the off-state current of the transistor 162 is small, stored datacan be held for a long time owing to such a transistor. In other words,power consumption can be sufficiently reduced because a semiconductordevice in which refresh operation is unnecessary or the frequency ofrefresh operation is extremely low can be provided.

An insulating layer 150 having a single-layer structure or astacked-layer structure is provided over the transistor 162. Inaddition, a conductive layer 148 b is provided in a region overlappingwith the electrode layer 142 a of the transistor 162 with the insulatinglayer 150 interposed therebetween, and the electrode layer 142 a, theinsulating layer 150, and the conductive layer 148 b form a capacitor164. That is, the electrode layer 142 a of the transistor 162 functionsas one electrode of the capacitor 164, and the conductive layer 148 bfunctions as the other electrode of the capacitor 164. Note that thecapacitor 164 may be omitted if a capacitor is not needed.Alternatively, the capacitor 164 may be separately provided above thetransistor 162.

The insulating layer 152 is provided over the transistor 162 and thecapacitor 164. Further, a wiring 156 is provided over the insulatinglayer 152. The wiring 156 is a wiring for connecting the transistor 162to another transistor. Although not illustrated in FIG. 8A, the wiring156 is electrically connected to the electrode layer 142 b through anelectrode layer formed in an opening provided in the insulating layer150, the insulating layer 152, or the like.

In FIGS. 8A and 8B, the transistor 160 and the transistor 162 areoverlapped with each other at least partly; it is preferable that asource region or a drain region of the transistor 160 overlap with partof the oxide semiconductor layer 144. Further, the transistor 162 andthe capacitor 164 are provided so as to overlap with at least part ofthe transistor 160. For example, the conductive layer 148 b of thecapacitor 164 is provided to at least partly overlap with the gateelectrode layer 110 of the transistor 160. With such a planar layout,the area occupied by the semiconductor device can be reduced; thus,higher integration can be achieved.

Next, an example of a circuit configuration corresponding to FIGS. 8Aand 8B is illustrated in FIG. 8C.

In FIG. 8C, a first line (1st Line) is electrically connected to asource electrode layer of the transistor 160. A second line (2nd Line)is electrically connected to a drain electrode layer of the transistor160. A third line (3rd Line) is electrically connected to one of asource electrode layer and a drain electrode layer of the transistor162, and a fourth line (4th Line) is electrically connected to a gateelectrode layer of the transistor 162. A gate electrode layer of thetransistor 160 and one of the source electrode layer and the drainelectrode layer of the transistor 162 are electrically connected to oneelectrode of the capacitor 164. A fifth line (5th Line) and the otherelectrode of the capacitor 164 are electrically connected to each other.

The semiconductor device shown in FIG. 8C utilizes a characteristic inwhich the potential of the gate electrode layer of the transistor 160can be held, and can thus write, hold, and read data as follows.

Writing and holding of data will be described. First, the potential ofthe fourth line is set to a potential at which the transistor 162 isturned on, so that the transistor 162 is turned on. Accordingly, thepotential of the third line is supplied to the gate electrode layer ofthe transistor 160 and to the capacitor 164. That is, predeterminedcharge is supplied to the gate electrode layer of the transistor 160(writing). Here, one of two kinds of charges providing differentpotentials (hereinafter referred to as a low-level charge and ahigh-level charge) is given. After that, the potential of the fourthline is set to a potential at which the transistor 162 is turned off, sothat the transistor 162 is turned off. Thus, the charge given to thegate electrode layer of the transistor 160 is held (storing).

Since the off-state current of the transistor 162 is extremely small,the charge of the gate electrode layer of the transistor 160 is held fora long time.

Next, reading data is described. By supplying an appropriate potential(a reading potential) to the fifth line while a predetermined potential(a constant potential) is supplied to the first line, the potential ofthe second line varies depending on the amount of charge held in thegate electrode layer of the transistor 160. This is because in general,when the transistor 160 is an n-channel transistor, an apparentthreshold voltage V_(th) _(_) _(H) in the case where the high-levelcharge is given to the gate electrode layer of the transistor 160 islower than an apparent threshold voltage V_(th) _(_) _(L) in the casewhere the low-level charge is given to the gate electrode layer of thetransistor 160. Here, an apparent threshold voltage refers to thepotential of the fifth line, which is needed to turn on the transistor160. Thus, the potential of the fifth line is set to a potential V₀which is between V_(th) _(_) _(H) and V_(th) _(_) _(L), whereby chargesupplied to the gate electrode of the transistor 160 can be determined.For example, in the case where a high-level charge is given in writing,when the potential of the fifth line is set to V₀ (>V_(th) _(_) _(H)),the transistor 160 is turned on. In the case where a low-level charge isgiven in writing, even when the potential of the fifth line is set to V₀(<V_(th) _(_) _(L)), the transistor 160 remains in an off state.Therefore, the data held can be read by the potential of the secondline.

Note that in the case where memory cells are arrayed to be used, onlydata of desired memory cells needs to be read. In the case where suchreading is not performed, a potential at which the transistor 160 isturned off regardless of the state of the gate electrode layer of thetransistor 160, that is, a potential smaller than V_(th) _(_) _(H) maybe given to the fifth line. Alternatively, a potential at which thetransistor 160 is turned on regardless of the state of the gateelectrode layer, that is, a potential higher than V_(th) _(_) _(L) maybe given to the fifth line.

When a transistor having a channel formation region formed using anoxide semiconductor and having extremely small off-state current isapplied to the semiconductor device in this embodiment, thesemiconductor device can hold stored data for an extremely long period.In other words, power consumption can be adequately reduced becauserefresh operation becomes unnecessary or the frequency of refreshoperation can be extremely low. Moreover, stored data can be held for along period even when power is not supplied (note that a potential ispreferably fixed).

Further, in the semiconductor device described in this embodiment, highvoltage is not needed for writing data and there is no problem ofdeterioration of elements. For example, unlike a conventionalnon-volatile memory, it is not necessary to inject and extract electronsinto and from a floating gate, and thus a problem such as deteriorationof a gate insulating layer does not occur at all. In other words, thesemiconductor device according to one embodiment of the presentinvention does not have a limit on the number of times of writing whichis a problem in a conventional nonvolatile memory, and reliabilitythereof is drastically improved. Furthermore, data is written dependingon the on state and the off state of the transistor, whereby high-speedoperation can be easily realized.

As described above, a miniaturized and highly-integrated semiconductordevice having high electric characteristics and a method formanufacturing the semiconductor device can be provided.

The methods and structures described in this embodiment can be combinedas appropriate with any of the methods and structures described in theother embodiments.

Embodiment 4

In this embodiment, one embodiment of a structure of a memory devicewhich is different from that in Embodiment 3 will be described.

FIG. 9 is a perspective view of a memory device. The memory deviceillustrated in FIG. 9 includes a plurality of layers of memory cellarrays (memory cell arrays 3400(1) to 3400(n) (n is an integer greaterthan or equal to 2)) each including a plurality of memory cells asmemory circuits in the upper portion, and a logic circuit 3004 in thelower portion which is necessary for operating the memory cell arrays3400(1) to 3400(n).

FIG. 9 illustrates the logic circuit 3004, the memory cell array3400(1), and the memory cell array 3400(2), and illustrates a memorycell 3170 a and a memory cell 3170 b as typical examples among theplurality of memory cells included in the memory cell array 3400(1) andthe memory cell array 3400(2). The memory cell 3170 a and the memorycell 3170 b can have a configuration similar to the circuitconfiguration described in the above embodiment, for example.

Note that a transistor 3171 a included in the memory cell 3170 a isillustrated in FIG. 10 as a typical example. Further, a transistor 3171b included in the memory cell 3170 b is illustrated as a typicalexample. In the transistor 3171 a and the transistor 3171 b, a channelformation region is formed in an oxide semiconductor layer. Thestructure of the transistor in which the channel formation region isformed in the oxide semiconductor layer is the same as the structuredescribed in Embodiment 1 or 2, and thus the description of thestructure is omitted.

An electrode layer 3501 a that is formed in the same layer as a sourceelectrode layer and a drain electrode layer of the transistor 3171 a iselectrically connected to an electrode layer 3003 a through an electrodelayer 3502 a. An electrode 3501 c that is formed in the same layer as asource electrode layer and a drain electrode layer of the transistor3171 b is electrically connected to an electrode layer 3003 c through anelectrode layer 3502 c.

The logic circuit 3004 includes a transistor 3001 in which asemiconductor material except an oxide semiconductor is used as achannel formation region. The transistor 3001 can be a transistorobtained in such a manner that an element isolation insulating layer3106 is provided over a substrate 3000 including a semiconductormaterial (e.g., silicon) and a region serving as the channel formationregion is formed in a region surrounded by the element isolationinsulating layer 3106. Note that the transistor 3001 may be a transistorobtained in such a manner that the channel formation region is formed ina semiconductor film such as a polycrystalline silicon film formed on aninsulating surface or in a silicon film of an SOI substrate. Descriptionof the transistor 3001 is omitted because a known structure can be used.

A wiring 3100 a and a wiring 3100 b are formed between layers in whichthe transistor 3171 a is formed and layers in which the transistor 3001is formed. An insulating layer 3140 a is provided between the wiring3100 a and the layer in which the transistor 3001 is formed, aninsulating layer 3141 a is provided between the wiring 3100 a and thewiring 3100 b, and an insulating layer 3142 a is provided between thewiring 3100 b and the layer in which the transistor 3171 a is formed.

Similarly, a wiring 3100 c and a wiring 3100 d are formed between thelayers in which the transistor 3171 b is formed and the layers in whichthe transistor 3171 a is formed. An insulating layer 3140 b is providedbetween the wiring 3100 c and the layers in which the transistor 3171 ais formed. An insulating layer 3141 b is provided between the wiring3100 c and the wiring 3100 d. An insulating layer 3142 b is providedbetween the wiring 3100 d and the layers in which the transistor 3171 bis formed.

The insulating layer 3140 a, the insulating layer 3141 a, the insulatinglayer 3142 a, the insulating layer 3140 b, the insulating layer 3141 b,and the insulating layer 3142 b function as interlayer insulatinglayers, and their surfaces are planarized.

The wirings 3100 a, 3100 b, 3100 c, and 3100 d enable electricalconnection between the memory cells, electrical connection between thelogic circuit 3004 and the memory cells, and the like.

An electrode layer 3303 included in the logic circuit 3004 can beelectrically connected to a circuit provided in the upper portion.

For example, as illustrated in FIG. 10, the electrode layer 3303 can beelectrically connected to the wiring 3100 a through an electrode layer3505. The wiring 3100 a can be electrically connected to an electrodelayer 3501 b of the transistor 3171 a through an electrode layer 3503 a.In this manner, the wiring 3100 a and the electrode layer 3303 can beelectrically connected to the source or the drain of the transistor 3171a. The electrode layer 3501 b serving as the source or the drain of thetransistor 3171 a can be electrically connected to an electrode layer3003 b through an electrode layer 3502 b. The electrode layer 3003 b canbe electrically connected to the wiring 3100 c through an electrodelayer 3503 b.

FIG. 10 illustrates an example in which the electrode layer 3303 and thetransistor 3171 a are electrically connected to each other through thewiring 3100 a; however, one embodiment of the disclosed invention is notlimited thereto. The electrode layer 3303 may be electrically connectedto the transistor 3171 a through either the wiring 3100 b or the wiring3100 a and the wiring 3100 b or through another layer electrode layerwithout using the wiring 3100 a or the wiring 3100 b.

FIG. 10 illustrates the structure where two wiring layers, i.e., awiring layer in which the wiring 3100 a is formed and a wiring layer inwhich the wiring 3100 b is formed are provided between the layers inwhich the transistor 3171 a is formed and the layers in which thetransistor 3001 is formed; however, the number of wiring layers providedtherebetween is not limited to two. One wiring layer or three or morewiring layers may be provided between the layers in which the transistor3171 a is formed and the layers in which the transistor 3001 is formed.

FIG. 10 illustrates the structure where two wiring layers, i.e., awiring layer in which the wiring 3100 c is formed and a wiring layer inwhich the wiring 3100 d is formed are provided between the layers inwhich the transistor 3171 b is formed and the layers in which thetransistor 3171 a is formed; however, the number of wiring layersprovided therebetween is not limited to two. One wiring layer or threeor more wiring layers may be provided between the layers in which thetransistor 3171 b is formed and the layers in which the transistor 3171a is formed.

The methods and structures described in this embodiment can be combinedas appropriate with any of the methods and structures described in theother embodiments.

Embodiment 5

In this embodiment, a central processing unit (CPU) at least part ofwhich includes the transistor disclosed in Embodiment 1 or 2 will bedescribed as an example of a semiconductor device.

FIG. 11A is a block diagram illustrating a specific structure of a CPU.The CPU illustrated in FIG. 11A includes an arithmetic logic unit (ALU)1191, an ALU controller 1192, an instruction decoder 1193, an interruptcontroller 1194, a timing controller 1195, a register 1196, a registercontroller 1197, a bus interface (Bus I/F) 1198, a rewritable ROM 1199,and an ROM interface (ROM I/F) 1189 over a substrate 1190. Asemiconductor substrate, an SOI substrate, a glass substrate, or thelike is used as the substrate 1190. The ROM 1199 and the ROM interface1189 may each be provided over a separate chip. Obviously, the CPUillustrated in FIG. 11A is only an example in which the configuration issimplified, and an actual CPU may have various configurations dependingon the application.

An instruction that is input to the CPU through the bus interface 1198is input to the instruction decoder 1193 and decoded therein, and then,input to the ALU controller 1192, the interrupt controller 1194, theregister controller 1197, and the timing controller 1195.

The ALU controller 1192, the interrupt controller 1194, the registercontroller 1197, and the timing controller 1195 conduct various controlsin accordance with the decoded instruction. Specifically, the ALUcontroller 1192 generates signals for controlling the operation of theALU 1191. While the CPU is executing a program, the interrupt controller1194 judges an interrupt request from an external input/output device ora peripheral circuit on the basis of its priority or a mask state, andprocesses the request. The register controller 1197 generates an addressof the register 1196, and reads/writes data from/to the register 1196 inaccordance with the state of the CPU.

The timing controller 1195 generates signals for controlling operationtimings of the ALU 1191, the ALU controller 1192, the instructiondecoder 1193, the interrupt controller 1194, and the register controller1197. For example, the timing controller 1195 includes an internal clockgenerator for generating an internal clock signal CLK2 based on areference clock signal CLK1, and supplies the internal clock signal CLK2to the above circuits.

In the CPU illustrated in FIG. 11A, a memory cell is provided in theregister 1196. As the memory cell of the register 1196, the memory celldescribed in Embodiment 3 or 4 can be used.

In the CPU illustrated in FIG. 11A, the register controller 1197 selectsoperation of holding data in the register 1196 in accordance with aninstruction from the ALU 1191. That is, the register controller 1197selects whether data is held by a logic element which inverts a logicalvalue or a capacitor in the memory cell included in the register 1196.When data holding by the logic element which inverts a logical value isselected, power supply voltage is supplied to the memory cell in theregister 1196. When data holding by the capacitor is selected, the datais rewritten in the capacitor, and supply of power supply voltage to thememory cell in the register 1196 can be stopped.

The power supply can be stopped by providing a switching element betweena memory cell group and a node to which a power supply potential VDD ora power supply potential VS S is supplied, as illustrated in FIG. 11B orFIG. 11C. Circuits illustrated in FIGS. 11B and 11C are described below.

FIGS. 11B and 11C each illustrate an example of a structure of a memorycircuit in which the transistor disclosed in Embodiment 1 or 2 is usedas a switching element for controlling supply of a power supplypotential to a memory cell.

The memory device illustrated in FIG. 11B includes a switching element1141 and a memory cell group 1143 including a plurality of memory cells1142. Specifically, as each of the memory cells 1142, the memory celldescribed in Embodiment 3 or 4 can be used. Each of the memory cells1142 included in the memory cell group 1143 is supplied with thehigh-level power supply potential VDD via the switching element 1141.Further, each of the memory cells 1142 included in the memory cell group1143 is supplied with a potential of a signal IN and the low-level powersupply potential VSS.

In FIG. 11B, the transistor described in Embodiment 1 or 2 is used asthe switching element 1141, and the switching of the transistor iscontrolled by a signal SigA supplied to a gate electrode layer thereof.

Note that FIG. 11B illustrates the configuration in which the switchingelement 1141 includes only one transistor; however, without limitationthereto, the switching element 1141 may include a plurality oftransistors. In the case where the switching element 1141 includes aplurality of transistors which serves as switching elements, theplurality of transistors may be connected to each other in parallel, inseries, or in combination of parallel connection and series connection.

Although the switching element 1141 controls the supply of thehigh-level power supply potential VDD to each of the memory cells 1142included in the memory cell group 1143 in FIG. 11B, the switchingelement 1141 may control the supply of the low-level power supplypotential VSS.

In FIG. 11C, an example of a memory device in which each of the memorycells 1142 included in the memory cell group 1143 is supplied with thelow-level power supply potential VSS via the switching element 1141 isillustrated. The supply of the low-level power supply potential VSS toeach of the memory cells 1142 included in the memory cell group 1143 canbe controlled by the switching element 1141.

When a switching element is provided between a memory cell group and anode to which the power supply potential VDD or the power supplypotential VSS is supplied, data can be held even in the case where anoperation of a CPU is temporarily stopped and the supply of the powersupply voltage is stopped; accordingly, power consumption can bereduced. Specifically, for example, while a user of a personal computerdoes not input data to an input device such as a keyboard, the operationof the CPU can be stopped, so that the power consumption can be reduced.

Although the CPU is given as an example, the transistor can also beapplied to an LSI such as a digital signal processor (DSP), a customLSI, or a field programmable gate array (FPGA).

The methods and structures described in this embodiment can be combinedas appropriate with any of the methods and structures described in theother embodiments.

Further, Table 1 shows a comparison between a spin-MRAM (spin-transfertorque MRAM) which is known as a spintronics device and a memoryincluding an oxide semiconductor.

TABLE 1 Spintronics Oxide (magnetic) semiconductor/Si 1) Heat resistanceUnstable Extremely stable (up to 150° C.) 2) Driving method Currentdrive Voltage drive 3) Principle of Change Spin Direction On/Off of FETwriting operation of Magnetic Substance 4) Si LSI Suitable for bipolarLSI Suitable for MOS LSI (MOS transistor is preferred in highintegration circuit (Bipolar transistor is unsuitable for HighIntegration), W is large) 5) Power for High Charge and discharge ofOverhead Joule heat is needed parasitic capacitance Smaller than inspintronics by 2 or 3 or more orders of magnitude 6) Non-volatilityUtilizing Spin Utilizing small off- state current 7) Number of timesUnlimited Unlimited of reading operation 8) 3D conversion Difficult (2layers at Easy (No limitation on most) the number of layers) 9) Degreeof 15 F² Depending on the degree integration (F²) of 3D conversion 10)Material Magnetic rare earth Oxide semiconductor (strategic material)material 11) Resistance to Low High magnetic field

As shown in Table 1, the memory in which a transistor including an oxidesemiconductor and a transistor including silicon are combined issignificantly different from the spintronics device in the drivingmethod, the principle of writing operation, the material, and the like.

Further, as shown in Table 1, the memory in which the transistorincluding an oxide semiconductor and the transistor including siliconare combined has advantages over the spintronics device in many aspectssuch as the heat resistance, the 3D conversion (stacked-layer structureof three or more layers), and the resistance to a magnetic field. Notethat the power for overhead shown in Table 1 is, for example, power forwriting data into a memory portion or the like in a processor, which iswhat is called power consumed for overhead.

As described above, the use of the memory including an oxidesemiconductor, which has more advantages than the spintronics devicemakes it possible to reduce power consumption of a CPU.

The methods and structures described in this embodiment can be combinedas appropriate with any of the methods and structures described in theother embodiments.

Embodiment 6

A semiconductor device disclosed in this specification can be applied toa variety of electronic devices (including game machines). Examples ofthe electronic devices include display devices of televisions, monitors,and the like, lighting devices, desktop personal computers and laptoppersonal computers, word processors, image reproduction devices whichreproduce still images or moving images stored in recording media suchas digital versatile discs (DVDs), portable compact disc (CD) players,radio receivers, tape recorders, headphone stereos, stereos, cordlessphone handsets, transceivers, portable wireless devices, mobile phones,car phones, portable game machines, calculators, portable informationterminals, electronic notebooks, e-book readers, electronic translators,audio input devices, cameras such as still cameras and video cameras,electric shavers, high-frequency heating appliances such as microwaveovens, electric rice cookers, electric washing machines, electric vacuumcleaners, air-conditioning systems such as air conditioners,dishwashers, dish dryers, clothes dryers, futon dryers, electricrefrigerators, electric freezers, electric refrigerator-freezers,freezers for preserving DNA, smoke detectors, radiation counters, andmedical equipment such as dialyzers. Further, the examples includeindustrial equipment such as guide lights, traffic lights, beltconveyors, elevators, escalators, industrial robots, and power storagesystems. In addition, oil engines, moving objects driven by electricmotors using power from the non-aqueous secondary batteries, and thelike are also included in the category of electric devices. Examples ofthe moving objects include electric vehicles (EV), hybrid electricvehicles (HEV) which include both an internal-combustion engine and amotor, plug-in hybrid electric vehicles (PHEV), tracked vehicles inwhich caterpillar tracks are substituted for wheels of these vehicles,motorized bicycles including motor-assisted bicycles, motorcycles,electric wheelchairs, golf carts, boats or ships, submarines,helicopters, aircrafts, rockets, artificial satellites, space probes,planetary probes, spacecrafts, and the like. Specific examples of theseelectronic devices are shown in FIGS. 12A to 12C.

FIG. 12A illustrates a table 9000 having a display portion. In the table9000, a display portion 9003 is incorporated in a housing 9001 and animage can be displayed on the display portion 9003. Note that thehousing 9001 is supported by four leg portions 9002. Further, a powercord 9005 for supplying power is provided for the housing 9001.

The transistor described in Embodiment 1 or 2 can be used for thedisplay portion 9003 so that the electronic devices can have a highreliability

The display portion 9003 has a touch-input function. When a user touchesdisplayed buttons 9004 which are displayed on the display portion 9003of the table 9000 with his/her finger or the like, the user can carryout operation of the screen and input of information. Further, when thetable may be made to communicate with home appliances or control thehome appliances, the table 9000 may function as a control device whichcontrols the home appliances by operation on the screen. For example,with the use of a semiconductor device having an image sensor function,the display portion 9003 can have a touch-input function.

Further, the screen of the display portion 9003 can be placedperpendicular to a floor with a hinge provided for the housing 9001;thus, the table 9000 can also be used as a television device. When atelevision device having a large screen is set in a small room, an openspace is reduced; however, when a display portion is incorporated in atable, a space in the room can be efficiently used.

FIG. 12B illustrates a portable music player, which includes, in a mainbody 3021, a display portion 3023, a fixing portion 3022 with which themain body is worn on the ear, a speaker, an operation button 3024, anexternal memory slot 3025, and the like. When the transistor describedin Embodiment 1 or 2 or the memory described in Embodiment 3 or 4 isused in a memory or a CPU incorporated in the main body 3021, powerconsumption of the portable music player (PDA) can be further reduced.

Furthermore, when the portable music player illustrated in FIG. 12B hasan antenna, a microphone function, or a wireless communication functionand is used with a mobile phone, a user can talk on the phone wirelesslyin a hands-free way while driving a car or the like.

FIG. 12C illustrates a computer which includes a main body 9201including a CPU, a housing 9202, a display portion 9203, a keyboard9204, an external connection port 9205, a pointing device 9206, and thelike. The computer includes a semiconductor device manufacturedaccording to one embodiment of the present invention for the displayportion 9203. When the CPU described in Embodiment 5 is used, powerconsumption of the computer can be reduced.

FIGS. 13A and 13B illustrate a tablet terminal that can be folded. InFIG. 13A, the tablet terminal is opened, and includes a housing 9630, adisplay portion 9631 a, a display portion 9631 b, a switch 9034 forswitching display modes, a power switch 9035, a switch 9036 forswitching to power-saving mode, a fastener 9033, and an operation switch9038.

In such a portable device illustrated in FIGS. 13A and 13B, an SRAM or aDRAM is used as a memory for temporarily storing image data. Forexample, the semiconductor device described in Embodiment 3 or 4 can beused as a memory. The semiconductor device described in the aboveembodiment employed for the memory enables writing and reading of datato be performed at high speed, enables data to be held for a long time,and enables power consumption to be sufficiently reduced.

A touch panel region 9632 a can be provided in a part of the displayportion 9631 a, in which data can be input by touching displayedoperation keys 9638. Note that FIG. 10 shows, as an example, that halfof the area of the display portion 9631 a has only a display functionand the other half of the area has a touch panel function. However, thestructure of the display portion 9631 a is not limited to this, and allthe area of the display portion 9631 a may have a touch panel function.For example, all the area of the display portion 9631 a can displaykeyboard buttons and serve as a touch panel while the display portion9631 b can be used as a display screen.

Like the display portion 9631 a, part of the display portion 9631 b canbe a touch panel region 9632 b. When a finger, a stylus, or the liketouches the place where a button 9639 for switching to keyboard displayis displayed in the touch panel, keyboard buttons can be displayed onthe display portion 9631 b.

Touch input can be performed concurrently on the touch panel regions9632 a and 9632 b.

The switch 9034 for switching display modes allows switching between alandscape mode and a portrait mode, color display and black-and-whitedisplay, and the like. With the switch 9036 for switching topower-saving mode, the luminance of display can be optimized inaccordance with the amount of external light at the time when the tabletterminal is in use, which is detected with an optical sensorincorporated in the tablet terminal. The tablet terminal may includeanother detection device such as a sensor for detecting orientation(e.g., a gyroscope or an acceleration sensor) in addition to the opticalsensor.

Note that FIG. 13A shows an example in which the display portion 9631 aand the display portion 9631 b have the same display area; however,without limitation thereon, one of the display portions may be differentfrom the other display portion in size and display quality. For example,one of them may be a display panel that can display higher-definitionimages than the other.

The tablet terminal is closed in FIG. 13B. The tablet terminal includesthe housing 9630, a solar battery 9633, a charge/discharge controlcircuit 9634, a battery 9635, and a DCDC converter 9636. Note that FIG.13B shows an example in which the charge and discharge control circuit9634 includes the battery 9635 and the DCDC converter 9636.

Since the tablet terminal can be folded, the housing 9630 can be closedwhen the tablet terminal is not in use. Thus, the display portions 9631a and 9631 b can be protected, thereby providing a tablet terminal withhigh endurance and high reliability for long-term use.

In addition, the tablet terminal illustrated in FIGS. 13A and 13B canhave a function of displaying a variety of kinds of data (e.g., a stillimage, a moving image, and a text image), a function of displaying acalendar, a date, the time, or the like on the display portion, atouch-input function of operating or editing the data displayed on thedisplay portion by touch input, a function of controlling processing bya variety of kinds of software (programs), and the like.

The solar battery 9633, which is attached on the surface of the tabletterminal, supplies electric power to a touch panel, a display portion,an image signal processor, and the like. Note that the solar battery9633 can be provided on one or both surfaces of the housing 9630, sothat the battery 9635 can be charged efficiently. When a lithium ionbattery is used as the battery 9635, there is an advantage of downsizingor the like.

The structure and the operation of the charge/discharge control circuit9634 illustrated in FIG. 13B are described with reference to a blockdiagram in FIG. 13C. The solar battery 9633, the battery 9635, the DCDCconverter 9636, a converter 9637, switches SW1 to SW3, and the displayportion 9631 are shown in FIG. 13C, and the battery 9635, the DCDCconverter 9636, the converter 9637, and the switches SW1 to SW3correspond to the charge/discharge control circuit 9634 in FIG. 13B.

First, an example of operation in the case where power is generated bythe solar battery 9633 using external light is described. The voltage ofpower generated by the solar battery is raised or lowered by the DCDCconverter 9636 so that a voltage for charging the battery 9635 isobtained. When the display portion 9631 is operated with the power fromthe solar battery 9633, the switch SW1 is turned on and the voltage ofthe power is raised or lowered by the converter 9637 to a voltage neededfor operating the display portion 9631. In addition, when display on thedisplay portion 9631 is not performed, the switch SW1 is turned off anda switch SW2 is turned on so that charge of the battery 9635 may beperformed.

Here, the solar battery 9633 is shown as an example of a powergeneration means; however, there is no particular limitation on a way ofcharging the battery 9635, and the battery 9635 may be charged withanother power generation means such as a piezoelectric element or athermoelectric conversion element (Peltier element). For example, thebattery 9635 may be charged with a non-contact power transmission modulewhich is capable of charging by transmitting and receiving power bywireless (without contact), or another charging means may be used incombination.

In a television set 8000 in FIG. 14A, a display portion 8002 isincorporated in a housing 8001. The display portion 8002 displays animage and a speaker portion 8003 can output sound. The transistordescribed in Embodiment 1 or 2 can be used for the display portion 8002.

A semiconductor display device such as a liquid crystal display device,a light-emitting device in which a light-emitting element such as anorganic EL element is provided in each pixel, an electrophoretic displaydevice, a digital micromirror device (DMD), a plasma display panel(PDP), or a field emission display (FED) can be used for the displayportion 8002.

The television set 8000 may be provided with a receiver, a modem, andthe like. With the receiver, the television set 8000 can receive ageneral television broadcast. Furthermore, when the television set 8000is connected to a communication network by wired or wireless connectionvia the modem, one-way (from a transmitter to a receiver) or two-way(between a transmitter and a receiver, between receivers, or the like)data communication can be performed.

In addition, the television set 8000 may include a CPU for performinginformation communication or a memory. Any of the memories and the CPUdescribed in Embodiments 3 to 5 can be used for the television set 8000.

In FIG. 14A, an air conditioner which includes an indoor unit 8200 andan outdoor unit 8204 is an example of an electric device in which theCPU of Embodiment 5 is used. Specifically, the indoor unit 8200 includesa housing 8201, an air outlet 8202, a CPU 8203, and the like. Althoughthe CPU 8203 is provided in the indoor unit 8200 in FIG. 14A, the CPU8203 may be provided in the outdoor unit 8204. Alternatively, the CPU8203 may be provided in both the indoor unit 8200 and the outdoor unit8204. Since the CPU of Embodiment 5 is formed using an oxidesemiconductor, an air conditioner which has excellent heat resistanceproperty and high reliability can be provided with the use of the CPU.

In FIG. 14A, an electric refrigerator-freezer 8300 is an example of anelectric device which is provided with the CPU formed using an oxidesemiconductor. Specifically, the electric refrigerator-freezer 8300includes a housing 8301, a door for a refrigerator 8302, a door for afreezer 8303, a CPU 8304, and the like. In FIG. 14A, the CPU 8304 isprovided in the housing 8301. When the CPU described in Embodiment 5 isused as the CPU 8304 of the electric refrigerator-freezer 8300, powerconsumption of the electric refrigerator-freezer 8300 can be reduced.

FIG. 14B illustrates an example of an electric vehicle which is anexample of an electric device. An electric vehicle 9700 is equipped witha secondary battery 9701. The output of the electric power of thesecondary battery 9701 is adjusted by a control circuit 9702 and theelectric power is supplied to a driving device 9703. The control circuit9702 is controlled by a processing unit 9704 including a ROM, a RAM, aCPU, or the like which is not illustrated. When the CPU described inEmbodiment 5 is used as the CPU in the electric vehicle 9700, powerconsumption of the electric vehicle 9700 can be reduced.

The driving device 9703 includes a DC motor or an AC motor either aloneor in combination with an internal-combustion engine. The processingunit 9704 outputs a control signal to the control circuit 9702 based oninput data such as data of operation (e.g., acceleration, deceleration,or stop) by a driver or data during driving (e.g., data on an upgrade ora downgrade, or data on a load on a driving wheel) of the electricvehicle 9700. The control circuit 9702 adjusts the electric energysupplied from the secondary battery 9701 in accordance with the controlsignal of the processing unit 9704 to control the output of the drivingdevice 9703. In the case where the AC motor is mounted, although notillustrated, an inverter which converts direct current into alternatecurrent is also incorporated.

The methods and structures described in this embodiment can be combinedas appropriate with any of the methods and structures described in theother embodiments.

This application is based on Japanese Patent Application serial no.2012-025469 filed with Japan Patent Office on Feb. 8, 2012, the entirecontents of which are hereby incorporated by reference.

1. (canceled)
 2. A semiconductor device comprising: an oxidesemiconductor layer; a source electrode layer over the oxidesemiconductor layer; a drain electrode layer over the oxidesemiconductor layer; a gate insulating layer over the oxidesemiconductor layer; a gate electrode layer over the gate insulatinglayer; a first insulating film over the gate electrode layer; a secondinsulating film over the first insulating film; and wherein the firstinsulating film covers a side surface and an upper surface of the gateelectrode layer, wherein the first insulating film is in contact withthe gate insulating layer, wherein the second insulating film covers theside surface and the upper surface of the gate electrode layer, whereinthe gate insulating layer comprises silicon and oxygen, wherein thefirst insulating film comprises aluminum and oxygen, and wherein thesecond insulating film comprises any one of silicon oxide, siliconnitride, silicon oxynitride and silicon nitride oxide.
 3. Thesemiconductor device according to claim 2, further comprising: aninsulating layer over the second insulating film; a source wiring layerover the insulating layer and in contact with the source electrodelayer; and a drain wiring layer over the insulating layer and in contactwith the drain electrode layer.
 4. The semiconductor device according toclaim 2, wherein the first insulating film is in contact with the sidesurface and the upper surface of the gate electrode layer.
 5. Thesemiconductor device according to claim 2, wherein each of the sourceelectrode layer and the drain electrode layer is in contact with thefirst insulating film and the second insulating film.
 6. Thesemiconductor device according to claim 3, wherein the source electrodelayer is in contact with the insulating layer.
 7. The semiconductordevice according to claim 2, wherein the first insulating film has alower oxygen-transmitting property than the gate insulating layer.
 8. Amemory device comprising the semiconductor device according to claim 2.9. A semiconductor device comprising: a first transistor comprising asilicon semiconductor layer; a first insulating layer over the firsttransistor; an oxide semiconductor layer over the first insulatinglayer; a source electrode layer over the oxide semiconductor layer; adrain electrode layer over the oxide semiconductor layer; a gateinsulating layer over the oxide semiconductor layer; a gate electrodelayer over the gate insulating layer; a first insulating film over thegate electrode layer; and a second insulating film over the firstinsulating layer; wherein the first insulating film covers a sidesurface and an upper surface of the gate electrode layer, wherein thefirst insulating film is in contact with the gate insulating layer,wherein the second insulating film covers the side surface and the uppersurface of the gate electrode layer, wherein the gate insulating layercomprises silicon and oxygen, wherein the first insulating filmcomprises aluminum and oxygen, wherein the second insulating filmcomprises any one of silicon oxide, silicon nitride, silicon oxynitrideand silicon nitride oxide, and wherein one of the source electrode layerand the drain electrode layer is electrically connected to the firsttransistor.
 10. The semiconductor device according to claim 9, furthercomprising: a second insulating layer over the second insulating film; asource wiring layer over the second insulating layer and in contact withthe source electrode layer; and a drain wiring layer over the secondinsulating layer and in contact with the drain electrode layer.
 11. Thesemiconductor device according to claim 9, wherein the first insulatingfilm is in contact with the side surface and the upper surface of thegate electrode layer.
 12. The semiconductor device according to claim 9,wherein each of the source electrode layer and the drain electrode layeris in contact with the first insulating film and the second insulatingfilm.
 13. The semiconductor device according to claim 10, wherein thesource electrode layer is in contact with the second insulating layer.14. The semiconductor device according to claim 9, wherein the firstinsulating film has a lower oxygen-transmitting property than the gateinsulating layer.
 15. A memory device comprising the semiconductordevice according to claim 9.